2026 ISSCC国际固态电路年度会议嘉宾演讲PPT合集（共37套打包）

1、ISSCC 2026SESSION 3Wearable and Wireless Biomedical Systems3.1:A Multimodal Biosensing System-on-Chip with Integrated Wireless Transceiver and Power Management for Stress Monitoring 2026 IEEE Interna。

2、ISSCC 2026SESSION 8Die-to-Die and High-Speed Electrical Transceivers 2026 IEEE International Solid-State Circuits Conference1 of 298.1:A 48Gb/s/lane 1.24Tb/s/mm UCIe-Compliant Die-to-Die Link Over 30。

3、ISSCC 2026SESSION 6Exploratory Receiver Architectures from GHz to THz6.1:Full-Duplex RF Canceler Achieving Wideband High-SI-Power Low-Noise Cancellation Through A Novel N-Path-Filter-Based Architectu。

4、ISSCC 2026SESSION 7Image Sensors and Ranging7.1:5442 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation 2026 IEEE Internation。

5、ISSCC 2026SESSION 36 Neural and Biomedical Interfaces36.1:ReFIND:A Resolution-Reconfigurable Bio-Signal Classification SoC Enabling 10Savings in AFE Power per Channel 2026 IEEE International Solid-St。

6、ISSCC 2026SESSION 9Wireless Power9.1:A Single-Power-Link 13.56MHz Wireless Power and Data Transfer System with Synchronized Phase-Shifted Time-Multiplexing Dual Uplinks for Implantable Voltammetry 20。

7、ISSCC 2026SESSION 5Sub-THz and mm-Wave Phased Arrays and Beamformers5.1:A Formation Flight Phased-Array Transceiver for Spatial Power Combining and Distributing Architecturesin Direct-to-Device Commu。

8、ISSCC 2026SESSION 33 Time-Varying Circuit Techniques from RF to mm-Wave33.1:A 22-to-25GHz CMOS Non-magnetic Balanced Circulator Achieving at Least 20dB TX-RX Isolation for an Antenna VSWR of 2 2026 I。

9、ISSCC 2026SESSION 4Analog Techniques&Amplifiers1 of 39 2026 IEEEInternational Solid-State Circuits Conference4.1:A 0.64mA,-108.2dB THD+N Class-D Amplifier with Neural-Assisted Pre-Reconfiguration。

10、ISSCC 2026SESSION 31 AI Accelerators31.1:A 14.08-to-135.69Token/s ReRAM-on-Logic Stacked Outlier-FreeLarge-Language-Model Accelerator with Block-Clustered Weight-Compression and Adaptive Parallel-Spe。

11、ISSCC 2026SESSION 37 Memory Interface37.1:A 72Gb/s/pin Single-Ended Driver-Cooperative Coded PAM3 Transceiver with Asymmetric Data-Dependent Equalization and Bias-Peaking for Chiplets and Memory Inte。

12、ISSCC 2026SESSION 35 Low Power Wireless Transceivers for Localizationand Communications35.1:CANCEL:A Cancellation-Aided Ambient IoT Nanopowered Communication System for Energy-Limited Tags 2026 IEEE 。

13、ISSCC 2026SESSION 28Innovations from Outside the(ISSCC)Box28.1:Importance of GaN for 5G and solid-state mm-Wave Circuits of the Future 2026 IEEE International Solid-State Circuits Conference1 of 25Im。

14、ISSCC 2026SESSION 32Low-Power Noise-Shaping ADCs32.1:A 98.5dB-SNDR 250kHz-BW 1V-Supply Continuous-Time Zoom ADC with Smart-Tracking and Floating-Tail-Resistor Linearized Gm-C Loop Filter 2026 IEEE In。

15、ISSCC 2026SESSION 34Integrated Radar and UWB Transceivers from Microwave to Sub-THz 2026 IEEEInternational Solid-State Circuits Conference34.1:A 128mW 24 Radar-on-Chip with Forward-DPLL-Locked Multi-。

16、ISSCC 2026SESSION 26Compute Power and Supply Modulators26.1:Coupled-OSC-based Converters Achieving 89.5%Peak Efficiency at 61MHz,1.82W/mm2 Power Density at 360MHz,and Inherent Even Phase Interleaving。

17、ISSCC 2026SESSION 30 Compute-in-Memory30.1:A 28nm 127.54TFLOPS/W MXFP6 and 117.42TFLOPS/W MXFP8 Compute-in-Memory Macro with Adaptive-Preserved-Bit-Width and Serial-Dual-Bit-Sliding Schemes 2026 IEEE。

18、ISSCC 2026SESSION 23Next-Generation Optical Transceivers23.1:A 32Gb/s/256Gb/s/Fiber Half-Rate Bandpass-Filtered Clock-Forwarding DWDM Optical Link in a 3D-Stacked 7nm EIC/65nm PIC Technology 2026 IEE。

19、ISSCC 2026SESSION 27Frequency Generators,Multipliers,and Modulators27.1:A 20-GHz Frequency Synthesizer with Spur-Shaping Modulator Achieving 46.2-fs Jitter and 76.5 dBc Worst-Case Fractional Spur 202。

20、ISSCC 2026SESSION 17Highlighted Chip Releases for AI 2026 IEEEInternational Solid-State Circuits ConferenceNVIDIA GB10:An SoC Built for AI Acceleration A.Skende1,G.Rosseel2,N.Pinckney31NVIDIA,Westfor。

21、ISSCC 2026SESSION 29Biochemical Sensors for Life Sciences and Agriculture29.1:A 48-Day Duration Pasting Bioelectronic Device Realizing Closed-Loop Realtime Detection and Precision Treatment for Type-。

22、ISSCC 2026SESSION 19High-Voltage,Isolated and Display Power19.1:Piggybacked SC-on-CSCR:A Modular On-Chip Switched-Capacitor Converter for 12-to-60V Input 1.8-to-5V Output Achieving 5.67mW/mm2Power De。

23、ISSCC 2026SESSION 20RF Transceiver Subsystems from cm-Wave to THz20.1 An Ultra-Compact Asymmetrically Load-Pulled Series Doherty Power Amplifier in 22nm FDSOI CMOS with 25.3dBm Psatand 29.7%PAE6dBfor。

24、ISSCC 2026SESSION 14Unusual Interconnects and Other Uses for Light14.1:THz-TSI:A 0.33pJ/b 264Gb/s Through-Silicon Interconnect Module for 3D Integration Utilizing Terahertz Coupling 2026 IEEE Interna。

25、ISSCC 2026SESSION 11Pipeline and Ultra-High-Speed Data Converters11.1:A 14b 400MS/s TDC-Assisted Pipelined-SAR ADC with Rail-to-Rail Input VTC and Background Time-Domain Error Calibration 2026 IEEE I。

26、ISSCC 2026SESSION 22Circuits in Extreme Environments1 of 4722.1:A Cryo-CMOS Color-Center Quantum Controller with Diamond Waveguide Micro-Chiplet Integration 2026 IEEE International Solid-State Circui。

27、ISSCC 2026SESSION 18Technology and Circuits for Domain-Specific Accelerators18.1:A 3.19pJ/b Electro-Optical Router with 18ns Setup Frame-Level Routing and 1-to-6 Wavelength-Flexible Link Capacity for。

28、ISSCC 2026SESSION 24Displays24.1:A 28nm CMOS 1-Chip In-Pixel Memory Backplane Circuit with Pixel-Level Sensing and Compensation for 6652-PPI MicroLED AR Glasses 2026 IEEE International Solid-State Ci。

29、ISSCC 2026SESSION 21Sensor Interfaces21.1:Sub-1mV-Accuracy,24-CH Synchronous Battery Monitoring IC with Bipolar-Sampling ADCs and Calibration Engines 2026 IEEE International Solid-State Circuits Conf。

30、ISSCC 2026SESSION 13Circuits for AI and AI for Circuits 2026 IEEE International Solid-State Circuits Conference1 of 3913.1:HYDAR:A 390K QPS,1574K QPS/W Hybrid Analog/Digital Compute-in-RRAM Accelerat。

31、ISSCC 2026SESSION 2Processors2.1:AMD Instinct MI350 Series GPUs 2026 IEEE International Solid-State Circuits Conference1 of 27AMD InstinctTMMI350 Series GPUsAMD CDNATM4-Based 3D-Stacked 3nm XCDs and 。

32、ISSCC 2026SESSION 12Frequency Synthesizersand VCOs12.1:A 74fs-Jitter,-59dBc-Spur Fractional-N DPLL Using a Supply-Resilient Time-Amplifying Dual-Ramp DTC 2026 IEEE International Solid-State Circuits 。

33、ISSCC 2026SESSION 1PlenaryDr.Rick TsaiV I C E C H A I R M A N&C E O O F M E D I A T E KAdvancing Horizons for AI:Perspectives on Semiconductor InnovationsF E B R U A R Y 2 0 2 6 2026 IEEE Interna。

34、ISSCC 2026SESSION 25Hardware Security25.1 HERACLES:8192-Way SIMD Programmable Scalable Fully-Homomorphic Encryption SoC for Privacy-Preserving Cloud Computing in Intel 3 CMOS 2026 IEEE International 。

35、ISSCC 2026SESSION 15DRAM,SRAM,and Non-Volatile Memories15.1:A 2Tb 4b/Cell 6-Plane 3D-Flash Memory with 37.6Gb/mm2 Bit Density and 85MB/s Write Throughput 2026 IEEE International Solid-State Circuits 。

36、ISSCC 2026SESSION 16Energy Harvesting,Piezo and ChargersPlease Scan to Rate This PaperPlease Scan to Rate This Paper16.2:A Bias-Flip-Based Piezoelectric Energy Harvesting Interface with a Digital Tra。

37、ISSCC 2026SESSION 10Digital Processing and Circuit Techniques10.1:A 3nm,400TOPS,1080k DMIPS SoC with Chiplet Support for ASIL D Automotive Cross-Domain Applications 2026 IEEE International Solid-Stat。