Session2 Processors.pdf

1、ISSCC 2026SESSION 2Processors2.1:AMD Instinct MI350 Series GPUs 2026 IEEE International Solid-State Circuits Conference1 of 27AMD InstinctTMMI350 Series GPUsAMD CDNATM4-Based 3D-Stacked 3nm XCDs and 6nm IODs for AI applicationsRamasamy Adaikkalavan1,Alan Smith1,Teja Singh1,Sundar Rangarajan1,Eric Ch

2、apman1,Samuel Naffziger2,Subramaniam Maiyuran3,Candy Chen4,Sriram Sundaram1,Mark Silla1,Duncan Law5,Kathy Hoover1,Samuel Lipson1,Kevin Duda2,Vinay Parthasarathy6,Deepesh John1,Hanish Vemulapalli1,Srinivas Pavan Kumar Gade71AMD,Austin,TX,2AMD,Fort Collins,CO,3AMD,Folsom,CA,4AMD,Shanghai,China,5AMD,Ma

3、rkham,Canada,6AMD,San Diego,CA,7AMD,Hyderabad,India2.1:AMD Instinct MI350 Series GPUs 2026 IEEE International Solid-State Circuits Conference2 of 27AMD InstinctTMMI350 Series Product GoalsGenerational performance throughput increase1.9x peak compute in same footprint11.5x peak HBM BW and capacity2En

4、hanced power efficiency“MI350 Series”Compute ThroughputPower EfficiencyMemoryCapacityArea“MI300 Series”MemoryBandwidth Compared to MI300X2.1:AMD Instinct MI350 Series GPUs 2026 IEEE International Solid-State Circuits Conference3 of 27Outline AMD Instinct MI350 Series Offerings Accelerator Complex Di

5、e(XCD)Area Efficiency Power Efficiency I/O Die Enhancements Power Distribution Performance Comparison2.1:AMD Instinct MI350 Series GPUs 2026 IEEE International Solid-State Circuits Conference4 of 27AMD Instinct MI350 Series DeliversPower-efficient Performance MXFP6,MXFP4 Datatype Support Up to 1.9x

6、peak theoretical performance1 1.5x HBM peak BW and Capacity2 Same Form Factor as MI300(UBB 2.0)Per OAM SocketMI300XMI350XMI355XPower(Watts,TBP)75010001400Compute Max Clock(MHz)210022002400HBM Capacity(GB)192288(1.5x)HBM peak BW(TB/s)5.38.0(1.5x)Compared to MI300XMI350X and MI355XOver 3x generational