Session24 Displays.pdf

1、ISSCC 2026SESSION 24Displays24.1:A 28nm CMOS 1-Chip In-Pixel Memory Backplane Circuit with Pixel-Level Sensing and Compensation for 6652-PPI MicroLED AR Glasses 2026 IEEE International Solid-State Circuits Conference1 of 27 A 28nm CMOS 1-Chip In-Pixel Memory Backplane Circuit with Pixel-Level Sensin

2、g and Compensation for 6652-PPI MicroLED AR GlassesYongil Kwon,Sunkwon Kim,Youngkil Choi,Taehyun Kwon,Seongyoung Ryu,Sewhan Na,Kangjoo Kim,Uijong Song,Hyun-Wook Lim,Jongwoo Lee,Jae-Yeol LeeSamsung Electronics,Korea24.1:A 28nm CMOS 1-Chip In-Pixel Memory Backplane Circuit with Pixel-Level Sensing and

3、 Compensation for 6652-PPI MicroLED AR Glasses 2026 IEEE International Solid-State Circuits Conference2 of 27 Outline Motivation Overall architecture Low power scheme Display quality enhancement scheme Measurement results Comparisons and Conclusions24.1:A 28nm CMOS 1-Chip In-Pixel Memory Backplane C

4、ircuit with Pixel-Level Sensing and Compensation for 6652-PPI MicroLED AR Glasses 2026 IEEE International Solid-State Circuits Conference3 of 27 Motivation Regarding the display,all-day wearable AR glasses requireCompact volume Low power consumptionDisplay quality:high resolution,uniformity,low flic

5、ker,low dynamic false contourDisplay engine with LEDoS&opticWaveguideCameraAudioBatteryWaveguideSpeakerPMIC1.8V/1.0V/-4.0VMIPISPIQSPI24.1:A 28nm CMOS 1-Chip In-Pixel Memory Backplane Circuit with Pixel-Level Sensing and Compensation for 6652-PPI MicroLED AR Glasses 2026 IEEE International Solid-Stat

6、e Circuits Conference4 of 27 Overall Architecture:1-Chip silicon backplane(Si-BP)Our 1-chip solution is compact,no inter-chip alignment,direct emission1-chip solution requires 1/3 pixel pitch to achieve equivalent PPI as a 3-chip solutionBlueLEDRedLEDGreenLEDP-substratep+p+n+n+p+p+p+p+Micro LensHybr