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1、The professional home for the engineering and technology community worldwideIEEE PROPRIETARYieee.orgThe professional home for the engineering and technology community worldwideIEEE and the Future of ChipletsTom CoughlinPresident,Coughlin Associates,Inc.2024 IEEE President2026 Chiplet Summit The prof

2、essional home for the engineering and technology community worldwideIEEE PROPRIETARY2026 Chiplet SummitOne IEEE Commitment to PurposeMission:IEEEs core purpose is to foster technological innovation and excellence for the benefit of humanityVision:IEEE will be essential to the global technical commun

3、ity and to technical professionals everywhere and be universally recognized for the contributions of technology and of technical professionals in improving global conditionsCommitment to the mission and vision from each of you is what empowers and defines IEEE.The professional home for the engineeri

4、ng and technology community worldwideIEEE PROPRIETARY2026 Chiplet SummitIEEE at a Glance500,000+members in more than 190 countries-More than 189,000 Student members39 technical Societies and eight technical Councils representing the wide range of IEEE technical interests 6 million+documents in the I

5、EEE Xplore digital library,with 24 million+downloads each month 1,079 active standards and 1,000+standards under developmentPublishes approximately 200 transactions,journals,and magazines Sponsors 2,000+conferences in 190 countries a year Continuing Technology Education ResourcesGlobal public policy

6、 and professional ethics International Climate Change engagement All figures as of February 2025The professional home for the engineering and technology community worldwideIEEE PROPRIETARY2026 Chiplet SummitTechnical Know-How that is Broad and DeepElectrical and electronic engineering,computer scien

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1. IEEE核心使命与愿景:致力于推动技术创新与卓越,服务 humanity,成为全球技术社区的核心力量。 2. 规模与影响力:50万+成员(190+国家),600万+文献(月下载2400万+),1079项现行标准,年办2000+会议。 3. 技术领导力:覆盖半导体、AI、物联网等30+领域,专利引用量居全球首位(较其他机构高近3倍,1997年以来增长864%)。 4. 芯片let技术:通过《异构集成路线图》推动2.5D/3D集成,联合SEMI、ASME等组织开发高密度封装方案。 5. 未来方向:新增4条技术路线图(如控制系统、能源),聚焦新兴技术社区与全球政策参与。
**IEEE芯片未来?** **技术如何创新?** **专利谁领先?**
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