20260218_A-101_Lin.PDF

1、Multiphysics Modeling for Early Vulnerability MitigationLang Lin,Principal Product ManagerFebruary 2026Legal DisclosureCONFIDENTIAL INFORMATIONThe information contained in this presentation is the confidential and proprietary information of Synopsys.You are not permitted to disseminate or use any of

2、 the information provided to you in this presentation outside of Synopsys without prior written authorization.IMPORTANT NOTICEThis presentation may include information related to Synopsys future product or business plans.Such plans are as of the date of this presentation and subject to change.Synops

3、ys is not obligated to update this presentation or develop the products with the features and/or functionality discussed in this presentation.Additionally,Synopsys products and services may only be offered and purchased pursuant to an authorized quote and purchase order or a mutually agreed upon wri

4、tten contract.FORWARD LOOKING STATEMENTSThis presentation may include certain statements including,but not limited to,Synopsys financial targets,expectations and objectives;business and market outlook,business opportunities,strategies and technological trends;and more.These statements are made only

5、as of the date hereof and subject to change.Actual results or events could differ materially from those anticipated in such statements due to a number of factors.Synopsys undertakes no duty to,and does not intend to,update any statement in this presentation,whether as a result of new information,fut

6、ure events or otherwise,unless required by law.2026 Synopsys,Inc.3Agenda Chip/chiplet/multi-die design security vulnerability?Early vulnerability mitigation through security verification Exemplar flows of side-channel and fault injection analysisChiplet Summit 2026 2026 Synopsys,Inc.4Security Assets