20260219_A-202_Khan.PDF

1、Die-to-Die Interconnect Defect Modeling&Repair ArchitectureMoiz Khan Anshuman Chandra Jonathan Gaudet Siemens 2026|Siemens Digital Industries Software|Tessent|Moiz Khan|2026-02-19Outline Die-to-Die InterconnectDefectsTests Types of Interconnect&DefectMicro-bumpsTSVHybrid Bonds Cluster Defects Interc

2、onnect Repair&Repair Architectures Summary Siemens 2026|Siemens Digital Industries Software|Tessent|Moiz Khan|2026-02-19Die-to-Die Interconnect 2.5D Package Chiplets side by side connected by interposer Passive Interposer:Only wires connecting chiplets 3D Package Multiple chiplets on top of each oth

3、er Die-to-Die Interconnect Physical connection between chiplets/interposer Increasing Interconnect Density,Power&BW needs 2.5D multi-die package3D multi-die package3 nm5 nm7 nmBridges due to wire proximityD2D InterconnectSource:ISSCC:Roadmap on 3D Interconnect Density-EE Times Asia Siemens 2026|Siem

4、ens Digital Industries Software|Tessent|Moiz Khan|2026-02-19Interconnect Defects Manufacturing defects Impact performance of multi-die package Can damage full package Yield$Hard defects:Opens&Shorts Connection fully open or shorted Weak Defect:Weak Opens&Short Interconnect structure not properly for

5、med or damaged Fault Models Stuck-at,transition and bridging fault models Diagnosis Requires unique signature for each defectFunctional logicFunctional logicHard/Weak open(Resistive Open)Hard/Weak short(Resistive Bridges)Die1Die2Stuck-At-0/1(DC)Siemens 2026|Siemens Digital Industries Software|Tessen

6、t|Moiz Khan|2026-02-19Die1Die2Interconnect TestFunctional logicFunctional logicHard/Weak open(Resistive Open)Hard/Weak short(Resistive Bridges)Die1Die2Stuck-At-0/1(DC)DefectTestStuck-at-0/1A fixed 0/1 on each interconnectHard BridgeCreate opposite value at each interconnect pairResistive Open(High-R