20260219_K-5_Glasco.PDF

1、Chiplets for EveryoneDAVID GLASCO|VP R&D,COMPUTE SOLUTIONS GROUP,CADENCE CHIPLETS SUMMIT|FEBRUARY 2026Democratizing Chiplet Technology in the Physical AI eraSSG 2026 Cadence Design Systems,Inc.All rights reserved.TopicsChiplet Evolution,Current State,and Future Desired StateChiplet Technology Fundam

2、entals For the FutureThe Need for StandardizationThe Value of CollaborationAddressing the Complexity of Chiplet-Based DesignsSSG=2026:New Trends and AI EvolutionSSG 2026 Cadence Design Systems,Inc.All rights reserved.AI Driving Silicon and Systems Beyond Infrastructure AI$5.2TElectronic SystemsSilic

3、on$1.2THorizon 1 (1-3+years)2030 TAM2030 TAM$3.4TElectronic SystemsSilicon$680B2024 TAM2024 TAMCompute&NetworkingConsumerAuto&TransportationCommunications(wired&wireless)Industrial,Drones,RoboticsEnergyHealth&Science$873B$1.0T$1.1T$1.0T$489B$253BInfrastructure AIHorizon 2 (2-7+years)Physical AIPhysi

4、cal AIHorizon 3 (5-10+years)Sciences AISOURCE:IDC,2030 Semiconductor Market Outlook,25Q2 Update,doc#US53381325,May 2025$485BSSG 2026 Cadence Design Systems,Inc.All rights reserved.7The Proliferation of Physical AI SystemsAutonomous VehiclesDronesRoboticsAerospace and DefenseIntelligent interaction w

5、ith the real worldChiplets enable modular integration for high-performance computing at the edgeSSG 2026 Cadence Design Systems,Inc.All rights reserved.Cost efficiency systems optimized for needsTime-to-market speed for new solutionsSimplified software developmentPlug and play connectivityReference

6、platform(s)What Customers Tell Us They Want in Their Next-Gen Physical AI DesignsSSGChiplet Technology Fundamentals For the FutureSSG 2026 Cadence Design Systems,Inc.All rights reserved.Addressing ever-increasing compute demands in the physical AI eraThe 4 Cs of ChipletsCost EfficiencyReduced device