当前位置:首页 > 报告详情

20260218_C-103_Gusev.PDF

上传人: 彩旗 编号:1158877 2026-03-02 15页 2.67MB

1、Development Platforms for Edge ChipletsDmitriy GusevTechnical Director,Chiplet Platform Lead2/18/2026Copyright 2026 Menta S.A.S CONFIDENTIAL and PROPRIETARY MotivationChiplets are already ubiquitous in data center systems.They enable CPUs,GPUs,and large memory subsystems at scale.2/18/20262/18/20262

2、/18/20262/18/2026 Copyright 2026 Menta S.A.S CONFIDENTIAL and PROPRIETARY Industrial Customers:CapEx,Time-to-Market,and RisksChiplets make configurable and flexible systems possible Architecture To Be Adapted to embedded constraints.Chiplets:Unlocking Potentialin Constrained SystemsEdge:Challenges&C

3、onstraints2/18/20262/18/20262/18/20262/18/2026 Copyright 2026 Menta S.A.S CONFIDENTIAL and PROPRIETARY Evolving FunctionalityPerformance DemandsTARGET:Build a flexible chiplet platform,capable of delivering performance within cost,power,and form-factor constraints.System ConstraintsRapidly evolving

4、AI modelsSoftware-defined behaviorIncreasing functional complexityContinuously increasing compute needsHigher video resolutionsLarger communication bandwidthsCost sensitivityPower and thermal budgetsForm-factor limitationsModular.Efficient.Scalable.Chiplet Approach2/18/20262/18/20262/18/20262/18/202

5、6 Copyright 2026 Menta S.A.S CONFIDENTIAL and PROPRIETARY Provide Pre-designed,Pre-validated building blocksChiplets for SiP =IP blocks for SoCAccelerated Integration13Key BenefitsCost and ReuseFlexibility and Scalability2Pre-tested functional blocksReduced development riskFaster system bring-upProc

6、ess Node mixFaster ScalabilityReuse of existing designsBetter control of non-recurring costsChiplets enable long-term value through reuse,scalability and modularityOnly works when interoperability is addressedand the ecosystem reaches sufficient maturity(1)Addressing Modularity:Hub2/18/20262/18/2026

word格式文档无特别注明外均可编辑修改,预览文件经过压缩,下载原文更清晰!
三个皮匠报告文库所有资源均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
1. **Chiplet平台价值**:Chiplets已在数据中心普及,通过模块化设计降低成本、风险,加速上市时间(TTM),并支持系统灵活扩展。 2. **核心挑战**:需解决互操作性、工艺节点差异及协议层兼容性问题,以实现跨厂商、跨节点的模块化组合。 3. **Hub架构优势**:集中式Hub整合CPU、内存、DMA及高速互连,支持异构连接,稳定基础架构并独立演进外设Chiplet。 4. **经济性**:成熟工艺节点优化成本,混合匹配不同节点(如Hub/计算/传感器),降低非经常性支出(NRE)并提升良率。 5. **应用场景**:面向边缘/工业领域,如实时定位系统(RTLS)和边缘AI,通过软件栈集中化实现控制与复用。
**芯片模块化优势?** **边缘计算挑战?** **芯片平台经济性?**
客服
商务合作
小程序
服务号
折叠