20260219_A-201_Deo.PDF

1、Engineering Resilient IC PackagesSudarshan Deo,Andras Vass-Varnai,Bharad Gundepudi3D IC Solutions EngineeringSiemens DISWMotivationReticle SizeHeterogeneous Intg.ModularizationCostYieldBandwidth(Memory)Explosive adoption of AI,HPC,and heterogeneous computing2.5D/3D IC packaging is now essential for

2、performance scalingMechanical reliability challenges grow dramatically:High power densitiesMaterial CTE mismatches 3D geometries and stacked memoryTraditional workflows isolate electrical and mechanical teams too slow,too lateRestricted|Siemens 2025|Siemens Digital Industries SoftwarePage 2How is me

3、chanical analysis different for 3DIC?Restricted|Siemens 2025|Siemens Digital Industries SoftwarePage 3Traditional flows handle:Thermal modeling separate from electrical designMechanical modeling created manually late in the cycleReliability prediction performed only for mature designsThis leads to:L

4、ate-stage failuresCostly redesignsPoor cross-team communicationIntegrated thermo-mechanical design and modeling flowUnrestricted|Siemens 2026|Siemens Digital Industries SoftwareSynchronize 2.5/3D designs with thermo-mechanical modeling Facilitate collaboration among IC designer,package architect and

5、 simulation analyst Automate multiphysics model building and setupLeverage market leading technologies in Siemens,such as Calibre,Simcenter Simlab and FlothermI3D Reliability ToolkitThermal/mechanical modelsSimcenter FlothermPage 4Innovator3D IC SiP level modeling architectural to sign-off cockpit S

6、imcenter Simlab Stress/Warpage/Vibration/ReliabilityCalibre 3DThermalECAD/MCAD fileCalibre 3DStressPhysics covered:-Thermal-Stress/strain-Vibration(fatigue)-Thermal/power cycling fatigueExperimental Package OverviewUnrestricted|Siemens 2026|Siemens Digital Industries SoftwareThe selected package is