20260218_H-103_Nowroozi.PDF

1、1H-103 Chiplet Summit 2026 LIGHTMATTERComposable Interconnect for 400 Gb/s/Lane AI Systems H-103 DesignBijan Nowroozi Head of Ecosystem Development2 2Master Slide TemplateH-103 Chiplet Summit 2026 LIGHTMATTERTHE NETWORK IS BECOMING THE COMPUTER3H-103 Chiplet Summit 2026 LIGHTMATTERThe Trend:Extendin

2、g the Die with IODIEDIEDIEDIEDIEDIEDIEMCM Organic SubstrateLogic+IO w D2DReticle LimitedMonolithic Die2.5D InterposerAbstracted+Disaggregated3D InterposerAbstracted+Disaggregated+Stacked(RDL etc)TransistorDIE ScalingIO Scaling3D IO ScalingDIEDIE4H-103 Chiplet Summit 2026 LIGHTMATTERExtending the Tre

3、nd:Networking Needs More IO224G448G448G224G224G224G800G Link=16 Wires.1 TX channel:2 wires 0101011 RX channel:2 wires 010101 This 102T switch ASIC requires at least 2040 224G traces or wires.112G112G112G112G112G112G112G112GOptical Interconnect Forum(OIF)Common Electrical I/O(CEI)Roadmap 5H-103 Chipl

4、et Summit 2026 LIGHTMATTERTRAYRACKCLUSTERCHIPLETDIEMore Than Moore:The Network Did Become The ComputerScaleOutUpAcrossAt every level,from transistors to clusters,performance is governed by network efficiency.INTER-CONNECT6 6Master Slide TemplateH-103 Chiplet Summit 2026 LIGHTMATTERWhats Standing in

5、the Way?7H-103 Chiplet Summit 2026 LIGHTMATTERThe Interconnect Bottleneck8H-103 Chiplet Summit 2026 LIGHTMATTERStopping Just Short of the GoalWe thought LEGOs.We have a Jigsaw Puzzle.We are paying an Integration Tax that stymies innovation.SerDesPCIeUCiE ABoWLogicUCiE SIEDM 2024 Short Course on AI S

6、ystems and the Next Leap Forward.Victor Moroz,“3DIC STCO for AI Systems”https:/ Chiplet Summit 2026 LIGHTMATTERTodays Scale-up Pod is limited by how many GPUs that can fit within a meter of the connector.Adding retimers to stretch a copper link is expensive(a dead end)in terms of space,spend,latency