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20260219_E-202_Peterson.PDF

上传人: 彩旗 编号:1158850 2026-03-02 25页 1.13MB

1、Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel 18ATrey Peterson QuickLogicIssy Kipnis,Tao Zhou Intel FoundryApplications are constrained by 3 competing requirements2eFPGA Chipletsprovide modular and reconfigurable acceleration01.Performance03.Adaptability02.LongevityUpgra

2、de vs.QualificationTraditional Architectures Force TradeoffsChiplets Localize Change3 Heterogeneous integration:Mix nodes/IP(logic,I/O,memory,.etc)Modular:Upgrade chiplets while preserving qualified baseline Standard interface(UCIe):interoperable die-to-die link that enables reuseMonolithicChiplet-b

3、ased(2.5D/3D)Change-Full respin+requalificationUpgrade one chiplet,preserve qualified baselineIntel 18A Enables High Performance4 RibbonFET for performance and power PowerVia improves IR drop and routing Onshore trusted manufacturingeFPGA Chiplet Overview5GPIO Bank GPIO Bank UCle LinkInterface Logic

4、UCIe AdapterUCIe PHYeFPGA CoreI/OCLBBRAMDSPeFPGA Chiplet Overview6GPIO Bank GPIO Bank UCle LinkInterface logicUCle AdapterUCle PHYeFPGA CoreI/OBRAMDSPCLBConfigurable Logic BlocksCombinatorial and sequential computationeFPGA Chiplet Overview7GPIO Bank GPIO Bank UCle LinkInterface logicUCle AdapterUCl

5、e PHYeFPGA CoreI/OCLBBRAMDSPDigital Signal ProcessingMath heavy operations and timing controlledeFPGA Chiplet Overview8GPIO Bank GPIO Bank UCle LinkInterface logicUCle AdapterUCle PHYeFPGA CoreI/OCLBDSPBlock RAMLocal storage for buffering+coefficientsBRAMeFPGA Chiplet Overview9GPIO Bank GPIO Bank UC

6、le LinkInterface logicUCle AdapterUCle PHYeFPGA CoreCLBBRAMDSPI/OI/O TilesGPIO bank+UCIe interfaceeFPGA Chiplet Overview10GPIO Bank GPIO Bank eFPGA CoreI/OCLBBRAMDSPUCle LinkInterface LogicUCIe AdapterUCIe PHYUCIeInteroperable chiplet boundaryDevelopment Environment11FPGA userQuickLogicFree&OpenSour

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1. **eFPGA Chiplet价值**:解决应用性能、长寿命、适应性三大竞争需求,支持异构集成,模块化升级且保留已验证基线,通过UCIe标准接口实现互操作。 2. **Intel 18A工艺优势**:RibbonFET提升性能功耗比,PowerVia改善压降与布线,岸端可信制造。 3. **eFPGA核心组件**:包含CLB(组合/时序逻辑)、DSP(数学运算)、BRAM(本地存储)、I/O及UCIe接口,支持灵活配置。 4. **DSP应用场景**:可加速ADC/DDC/滤波等模块,实现并行硬件执行、确定性延迟及后硅片适应性,支持5G/6G、机器人、汽车等场景。 5. **扩展能力**:通过多芯片堆叠(SCALE)、分区(PARTITION)或模块化升级(MODULAR)扩展资源,无需全芯片重新验证。
**eFPGA优势?** (吸引关注性能与灵活性的工程师,突出异构集成的核心价值) **UCIe作用?** (吸引关注标准化与互操作性的开发者,强调接口的革新意义) **DSP加速?** (吸引信号处理领域专家,点明eFPGA在实时应用中的独特能力)
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