DCON26_PAPER_Track01_PracticalModelingof3DInterconnectswithHatchedGroundPlanesinSiliconInterposersBridgesFl_140_7.pdf

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1、 Information Classification:General Practical Modeling of 3D Interconnects with Hatched Ground Planes in Silicon Interposer,Bridges,and Flex PCBs HeeSoo LEE,Keysight Technologies hee-soo_,1-707-577-4832 Information Classification:General Seungjoon Yoon,Samsung Electronics ,+82-31-301-7099 Orlando Be

2、ll,GigaTest Labs ,+1-408-594-5279 Jaehyun Cho,WiSOL Co.,Ltd jhchowisol.co.kr Hyeon-Woo Ha,WiSOL Co.,Ltd hwhawisol.co.kr Jinhee Kim,WiSOL Co.,Ltd kimjhwisol.co.kr Taejong Jeong,Keysight Technologies ,+82 2-2004-5293 Tim Wang-Lee,Keysight Technologies tim.wang-,+1 707-577-3255 Information Classificati

3、on:General Abstract The rapid growth of AI/ML market has driven demand for advanced packaging technologies,including silicon interposers and bridges used in chiplets,3DHI,and 3DIC architectures.These structures would require thin layers and gas evacuation during manufacturing,making solid ground pla

4、nes impractical due to the risk of defects like delamination.To address this,patterned ground planes,such as hatched,meshed,or waffles,are used for manufacturability,reliability,and flexibility.Similar issues arise in flex PCBs,commonly found in mobile devices.However,these patterned geometries intr

5、oduce significant modeling challenges for signal and power integrity due to their complexity.Effects include changes in impedance,increased loss,resonance,and crosstalk,all of which require precise modeling to achieve faster design turnaround time and cost reduction.Traditional 2D solvers are often

6、insufficient to deal with higher data rates,and while 3D EM solvers offer accuracy,they struggle with lossy materials and complex stack-ups,especially when 3D interconnects with hatched ground planes are present.This paper introduces a practical modeling approach that uses a specially designed quasi