英特尔服务器设计战略创新：提升 19 英寸高密度机架式服务器的兼容性和性能.pdf

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1、Strategic Innovations in Intel Server Design:Strategic Innovations in Intel Server Design:Enhancing Compatibility and Performance inEnhancing Compatibility and Performance in19 inches High Density Rack Server19 inches High Density Rack ServerIntelStrategic Innovations in Intel Server Design:Enhancin

2、g Compatibility and Performance in19 inches High Density Rack ServerSERVERAnn Yen,Thonas SuIntelAgenda Preface-Impossible or Im Possible Layout Example Via Placement Suggestion and Crosstalk Simulation Result DDR5 Channel Simulation ResultPreface-Impossible or Im PossibleBackgroundBackground Dimensi

3、ons of the processor increases Dual processors 2 SPC(slot per channel)configuration is not possible to fit into 19”RACK Dual processors 1 SPC configuration under traditional DIMM connector placement cannot fit into 19”RACKSolutionSolution Reduce DIMM pitch(values varies among designs)Shrink CPU keep

4、 out zone Adapt DIMM connector which can compliance with narrow DIMM pitch Adapt Via in Pad Plated Over(VIPPO)in DIMM connectorDIMM1DIMM0CPUDIMM1DIMM02 Slots per ChannelDesignDIMM0DIMM0CPUDIMM0DIMM0CPU1Slot per ChannelDesignDIMM Pitch ReductionVIPPO and Pitch ReductionPhysicalLimitation5Intel Confid

5、entialRevision:X.XReference Number:XXXXXXLayout ExampleDIMM0DIMM0CPUDIMM0DIMM0CPUDIMM Pitch(DIMM to DIMM)32X milDIMM Pitch(DIMM to DIMM)26X milNarrow DIMM Pitch and VIPPO Layout ExampleNote:Note:VIPPO stands for Via in Pad Plated OverNon VIPPO,DIMM Pitch=32X milVIPPO,DIMM Pitch=32X milVIPPO,DIMM Pit

6、ch 26X mil7Intel ConfidentialRevision:X.XReference Number:XXXXXXDIMM to DIMM Via Placement Suggestion and Crosstalk Simulation Result CH6 CH7CH0 CH1 CH2 CH3CH4 CH5CH_6CH_6CH_7CH_7P5P5P15P15P30P30Layout and Port ViaPort 30Port 5CH_NCH_NCH_N+1CH_N+1Port 15Via Placement Suggestion(1 of 2)FarFar-End Cro