APEC（高级 PCIe 机箱兼容）用于未来的 HSIO 互连.pdf

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1、APEC(Advanced PCIe Enclosure APEC(Advanced PCIe Enclosure Compatible)for future HSIO interconnectionCompatible)for future HSIO interconnectionGoogle CloudAPEC(Advanced PCIe Enclosure Compatible)for future HSIO interconnectionEric ChangHardware Engineer/Google CloudSERVERProblem StatementProblem Stat

2、ementExisting interconnect standards such as PCIe CEM do not support modern data center requirements of PCIe lanes counts,multi-host PCIe,power delivery,OOB management,security and power delivery.Solution being proposedSolution being proposedAPEC(Advanced PCIe Enclosure Compatible)is an electrical m

3、echanical interface standard intended to advance the PCIe CEM standard with increased PCIe lane count,bandwidth,power,and management capability for use cases that need more advanced capabilities.Background of APECAPEC includes the following highlighted features and improvementsFollowed CEM for basic

4、 card outlinesPCIe Gen 6 capabilityx32 PCIe lane Bifurcation flexibility(e.g.2x16,4x8.)Full sideband support(present,reset,refclk)down to the x8 lane interfaceAPEC cards are likely primarily Endpoints,but may be configured as Root ports.Sideband signaling defined down to a x8 width.Dedicated interfa

5、ce pins for management including NC-SI interfaceHigh Power capability400W 12V 800W 54V 328 signal and isolation pins,16 power pinsDirect Lead Frame(DLF)and Surface Mount Technology(SMT)versions0.093”(+/-8%)board PCB thickness supportOverview of APECFeatureAPECCEMLane Count3216Lane BifurcationYesNoHi

6、gh Power400W 12V800W 54V75W(or extra cables)Port OptionsRoot Port&EndpointEndpoint onlyPCB Thickness0.096”enables complex stackups0.063”Openness:Openness:By providing a next generation standardized connector and card format for APEC,it enables seamless interoperability between different hardware arc