芯片到数据热阻以支持 30°C 冷却液.pdf

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1、Chip to Data Center Thermal Resistance to Support 30CAMDChip to Data Center Thermal Resistance to Support 30CPaul ArtmanFellow System Design Eng AMDCOOLING ENVIRONMENTSSOC Temperature InputsJunction Temperature CalculationPowerTla+JCCA+xJunction Temperature=Tjunc=Tla+P x(JC+CA)TCS for Direct Liquid

2、Cooling(DLC)TCS=Chiller/Cooler=FWSAir Temperature=A-Class+CDU ApproachLiquid Cooled DCASHRAE Facility Water Supply(FWS)Coolant Distribution Unit(CDU)ApproachASHRAE Technical Coolant Supply(TCS)Temperature Ranges17 to 45 C2 to 10C25 to 50CAir Cooled DCASHRAE Air Classes(A-Class)Coolant Distribution U

3、nit(CDU)ApproachASHRAE Technical Coolant Supply(TCS)Temperature Ranges25 to 45C5 to 17C35 to 50CThere are a Broad Range of TCS Temperatures1.40+C-Legacy DLC and Brown Field DC using Liquid to Air CDU2.30C-Colocation and Green Filed DC using Liquid to Liquid CDUs3.20C Future NeedTechnical Coolant Sup

4、ply(TCS)=Inlet TemperatureOCP Min Recommended Technical Fluid Temperature of 30CNvidia,Intel,AMD,MSFT,Samsung,&MetaASHRAE TCS Classes.ASHRAE is adding S20 and S25ASHRAE added S25.Ongoing discussion son adding S20Courtesy MPDI:https:/ MPDI:https:/ economizer Water-side economizer New data center buil

5、ds are primarily using chillersEconomizers improve operational energy efficiency of data centers using chillersWater-side economizers bypassmechanical chillers when outside ambient keeps tower water cooler than chillerWater-side Economizers Coolant Distribution Unit(CDU)Types8In-Row1.5+MW at 4C appr

6、oach100kW at 5C approach Liquid to Refrigerant180KW at 15C approachLiquid to Air400KW at 4C approachPerimeter7MW at 4C approachLiquid to LiquidLiquid to LiquidIn-RackLiquid to LiquidNote:CDUs today provide 1.2 to 1.5LPM/KW;future GPUs may require 2.0 LPM/KW at 50psiDLC will quick