开创性的AI散热技术：用于下一代AI ASIC的高功率冷板热通量达200W_cm².pdf

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1、Wiwynn ConfidentialPioneering AI Cooling:High Power Cold Plates with 200W/cm Heat Flux for Next-Gen AI ASICsWiwynn CorporationWiwynn ConfidentialJeff CA ChenThermal Engineer/Wiwynn CorporationJake HsiehThermal Engineer/Wiwynn CorporationPioneering AI Cooling:High Power Cold Plates with 200W/cm Heat

2、Flux for Next-Gen AI ASICsWiwynn ConfidentialEscalating Heat Flux in IC Packaging Drives Advanced Cooling SolutionsTraditional Cold Plate202220262030Heat FluxYear100W/cm2200W/cm2Over 400W/cm2Precision Cold PlateWiwynn ConfidentialPrecision Flow Channel Design Boosts Cooling EfficiencyFlow Channel De

3、signFlow DistributionFluid InletLow Flow RateHigh Flow RateUniform Fin DensityUniform Fin DensityTraditional Cold PlateHigh Fin DensityHigh Fin DensityLow Fin DensityFlow Channel DesignUniform Flow RateUniform Flow RateFlow DistributionFluid InletPrecision Cold PlateLow Flow RateLow Flow RateHigh Fl

4、ow RateLow Flow RateWiwynn ConfidentialElectrochemical Additive Manufacturing(ECAM)allows flexible and accurate production of cold plates with microchannels.ECAM Technology Enables the Design of High-Performance Cold PlatesBinder JettingLaser PowderBed FusionElectrochemical Additive ManufacturingPro

5、cessSinteringLaser MeltingElectrodepositionFeature Size400 m150 m100 mFlow Channel Shape ControlFair(Subject to Binder Bleed)Fair(Rough Edges)Good(Sharp and Vertical Wall)Thermal PerformanceLow(High Porosity)Good(After Heat Treatment)Good(High Purity Copper Deposition)Wiwynn ConfidentialCopper Ion E

6、lectrolyteAnodeMicro-scale Anode ArraysCopper Deposition within Active Electric FieldsFabrication of Flow Channels via ECAMFixtureBase Plate(Cathode)AnodeAnodeAnodeAnodeFixtureBase Plate(Cathode)AnodeAnodeAnodeCuCuCu+2eCuECAM enables the layer-by-layer fabrication of highly accurate 3D copper struct