拥抱人工智能：基础设施和先进热解决方案.pdf

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1、Embracing AI:Infrastructure and Advanced Thermal SolutionsAuras TechnologyEmbracing AI:Infrastructure and Advanced Thermal SolutionsSean LimManagerAuras TechnologyCOOLING ENVIRONMENTSOutline(Optional)21AI InfrastructureAdvanced Cooling SolutionComputational power is national strengthAI ModelsPerform

2、ance(%)#AI has become an arms race.AI Infrastructure Grow up to 2028 US$90B US$42BInvesting in GPU accelerates AI infrastructure deployments growth.The spending is expected to reach near US$90 billion by 2028.Source:IDC,2024,Worldwide Artificial Intelligence Infrastructure Forecast,20242028Server TD

3、Ps rapidly increaseA100MI-100FeynmanRubinB300B200H100H200MI-450MI-375MI-325MI-300/300XMI-200/250Gaudi 1Gaudi 3Gaudi 2Power Consumption drastically increaseMcKinsey predicts that data center power consumption will represent about 12%of total US demand in 2030.12%600kWNVL 288300kWAir CoolingDirect Liq

4、uid CoolingAdvanced Cooling SolutionAdvanced Cooling SolutionData CenterBuild coolingsolutionComputingcoolingsolution3DVC Heat sinkFanCold PlateRack ManifoldBuild ManifoldIn Row CDUQuick DisconnectRackAir CoolingDirect Liquid CoolingAdvanced Cooling SolutionThickness:0.2mmPitch:0.35mm0.4mmThickness:

5、0.15mmPitch:0.3mmThickness:0.1mmPitch:0.2mm0.25mm3N2NA14A10A7A5A32022202420262028203020322034700W945W1275W1720W2320W3130W4225WSingle PhaseTwo PhaseMaterialColdPlatePowerconsumptionPhotolithographyMIXCopper and Vapor ChamberPureCopperMIXCopper(Graphene&diamond)CoolingSolutionFlow Rate1.0LPM2.0LPM0.75

6、PM1.5LPM2.0PM3.0LPM1.0LPM 1.5LPM1LPM1.5LPM200kPA350kPA100kPA100kPA2Phase VC Cold Plate1.GrapheneCopper2.DiamondCopper500kPASiliconSingle Phase VC Cold PlateYearTransistor Density 1.8XPower Consumption Reduction 25%Computing speed promote 15%CDU output Pressure