双路数据中心服务器平台高密度DIMM系统的散热设计考虑因素.pdf

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1、Thermal Design Considerations for High-Density DIMM System in Dual-Socket Datacenter Server PlatformsIntelServerThermal Design Considerations for High-Density DIMM System in Dual-Socket Datacenter Server PlatformsJay WuTechnical Leader/IntelAs memory capacity and bandwidth demands continue to rise,s

2、ystem designs are pushing toward higher memory densityparticularly in dual-socket server platforms.This session will explore the thermal design challenges and considerations involved in supporting a 2-socket,32-DIMM configuration on the latest Intel Xeon platform within a standard 19-inch rack chass

3、is.In such configurations,DIMM pitch is constrained to 0.250.27,significantly increasing the complexity of memory cooling.We will present thermal evaluation results based on Intel-developed CPU and DDR5 Thermal Test Vehicles(TTVs),which simulate real-world heat profiles and airflow interactions.Abst

4、ractThe integration of 32 DIMMs into the latest server platformsupporting a 2-socket CPU configuration with 16 memory channels within a standard 19”chassisnecessitates specific design trade-offs.One key adjustment involves reducing the DIMM pitch from the typical 0.325”to 0.257”.This tighter spacing

5、 introduces greater challenges for effective memory cooling,particularly as upcoming platforms demand higher memory speeds,which in turn drive increased memory power consumption.Intel has conducted a DIMM pitch sensitivity study leveraging CFD simulations,wind tunnel testing,and system-level evaluat

6、ions to assess the impact of reduced DIMM pitch on airflow approach velocity and overall cooling performance.This analysis also aims to validate the accuracy of simulation results by comparing them against empirical test data.ObjectiveCFD SimulationThermal resistance and pressure drop are defined by