超越 ORv3 HPR 母线：利用液冷技术实现下一代 AI 机架功率等级.pdf

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1、Beyond ORv3 HPR Busbars:Enabling Next Gen AI Rack Power Levels with Liquid CoolingTE ConnectivityRay LinSystem Architect at TE ConnectivityHal Loket,System Architect,TE ConnectivityBrian Costello,System Architect,TE ConnectivityLily Zhang,Product Manager,TE ConnectivityRoger Luo,Mechanical Engineer,

2、TE ConnectivityDmitriy Shapiro,Mechanical Engineer,MetaJohn Fernandes,Thermal Engineer,MetaBeyond ORv3 HPR Busbars:Enabling Next Gen AI Rack Power Levels with Liquid CoolingDATA CENTER(DC)PHYSICAL INFRASTRUCTURECOOLING ENVIRONMENTSRACK&POWER Background Liquid cooled busbar design concept Testing&sim

3、ulation data Safety criteria&testing Call to actionOverviewRack level power requirements continue to riseAI load requirements already exceeding air cooling limits for ORv3 HPRLatest GPU releases require liquid coolingIncorporate liquid cooling technology to the busbar by leveraging existing infrastr

4、ucture LC busbar increases current carrying capacity in same footprint by 5xAllows for improved thermal performance of mating busbar connectorsORv3 HPR BackgroundRack Power(kW)0200400600800100012001400160018002000ORv2ORv3ORv3 HPR2027 AI Racks 2029 AI RacksDesign Considerations Temperature rise-30C M

5、ax Voltage drops-0.1V Max Thermal Interface Material-Thermal conductivity,electrical insulation,ease of assembly Safety-No contact between liquid and busbar copper Serviceability-Quick connections Mass-Reduce as much as possible Reliability-No leakage Cold Plate Design-Maximize cooling capability,ma

6、intain manufacturability and quality Hose Connections-Standardization,supply chain,ease of assembly Rack Mounting&Disruption-Maintain profile as close as possible to standardLiquid Cooled Busbar Design OverviewWarm Coolant Outlets(Shown at the Top)Chilled Coolant Inlets(Shown at the bottom)Full Rack