专题讨论：通过异构集成和开放式创新推进可扩展计算.pdf

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1、PanelPanel:Photonics&Photonics&ChipletsChiplets-Advancing Scalable Computing through Advancing Scalable Computing through Heterogeneous Integration and Open InnovationHeterogeneous Integration and Open InnovationCHIPLETS AND ADVANCED PACKAGING/PHOTONICSRobert Lo,ITRI(Moderator)Erik Chen,ArtiluxCT Ka

2、o,CadenceDebendra Das Sharma,IntelJawad Nasrullah,Palo Alto ElectronPanel:Photonics&Chiplets Panel-Advancing Scalable Computing through Heterogeneous Integration and Open InnovationModerator:Robert LoDeputy General Director/ITRICHIPLETS AND ADVANCED PACKAGING/PHOTONICS Modular Chiplet Architectures

3、and Heterogeneous Integration Overcoming 2.5D/3D Manufacturing Complexities Photonics and Chiplets Co-Evolution Standards and Toolchains Chiplet Testing Strategies and Tradeoffs Collaboration and Open InnovationKey Points:Key Points:Time SlotsTime SlotsAgendaTimeOpeningModerator-2 minsKey Issues to

4、Explore I(1 moderator+4 panelists)x 2 mins=10 minsKey Issues to Explore II(1 moderator+4 panelists)x 2 mins=10 minsKey Issues to Explore III(1 moderator+4 panelists)x 2 mins=10 minsKey Issues to Explore IV(1 moderator+4 panelists)x 2 mins=10 minsKey Issues to Explore V(1 moderator+4 panelists)x 2 mi

5、ns=10 minsKey Issues to Explore VI(1 moderator+4 panelists)x 2 mins=10 minsClosing(1 moderator+4 panelists)x 1 mins=5 minsAugust 6,2025 11:00 am-12:00 pm(60 mins)CHIPLETS AND ADVANCED CHIPLETS AND ADVANCED PACKAGING/PHOTONICSPACKAGING/PHOTONICSPanel:Photonics&Chiplets:Advancing Scalable Computing th

6、rough Heterogeneous Integration and Open InnovationDr.Dr.DebendraDebendra Das Sharma Das Sharma Senior FellowSenior FellowIntel Intel Dr.Erik ChenDr.Erik ChenCoCo-Founder and CEOFounder and CEOArtiluxArtiluxDr.CT KaoDr.CT KaoPE Group DirectorPE Group DirectorCadenceCadenceDr.Jawad NasrullahDr.Jawad