20260218_H-103_Lalgudi.PDF

1、Early-Stage Thermal Simulation and Design Space Exploration of 3DIC SystemsDr.Subramanian Lalgudi*,Karthikk Sridharan*,Dr.Oscar Moguel*,Mike Walsh*,Kevin Rinebold*,and Steve McKinney*Siemens Digital Software,*MicrosoftAgendaSiemens 3DIC thermal analysis workflowMicrosoft Hypothetical Silicon DesignT

2、hermal analysis using i3D-C3DTDesign Space Exploration with HLDSESummary2MotivationPower density and total power higher in 3DIC systems than monolithic SoCsSevere thermal problems are seen as soon as 3DIC systems are first brought upSo,there is a need for starting thermal analysis from early stages

3、of designExisting thermal workflows not adequate for a shift-left in the thermal analysis:Too inefficient or ineffective for increased number of thermal simulations3Main Idea:New thermal workflow for 3DICs New thermal workflow needed for 3DIC systems:Embed thermal analysis capability in 3DIC plannin

4、g tool,so early thermal feasibility can be doneReuse 3DIC floor plan already available;avoid recreation in a CFD toolDemocratize thermal simulation setup and run,so that an electrical engr.can do it with occasional help from thermal expertsAutomatically create thermal design files that can be open i

5、n SimcenterFlotherm,so that thermal experts can deep dive on a design if needed4Siemens 3DIC Thermal Analysis Workflow51)3DIC Floor plan can be input as 3DBLOX2)Creation of 3DIC Assembly requires thermal experts one-time help3)Execution can be done by SoC/PKG designers using one click4)Detailed and

6、additional thermal analysis can be done in Flotherm by thermal experts41.4 C103 CSource:IntelOne-click runAgendaMicrosoft Hypothetical Silicon Design6Microsoft Hypothetical Silicon Design7Mockup of the floorplan of theMicrosofts Hypothetical Silicon DesignHBM(Flothermmodel)InterposerDieHBMInterposer