20260218_B-102_Kolbehdari.PDF

1、THz/RF Corridors as a General in-package FabricFor Chiplets,HBM,and High-speed Die-die InterconnectAuthor:Dr.Moh KolbehdariDir.of Packaging Architecture,Socionext America Inc.Corridors as the Next Wave of In-Package Interconnect fabricFrom Chiplet Links to a Common In-Package FabricAI/HPC packages a

2、re evolving into dense in-package backplanessupporting multiple protocols and traffic classes.As die counts and distance grow,long in-package links increasinglyface board-level signal integrity and power challenges.This raises a fundamental architectural question for chipletsystems:Do we continue sc

3、aling electrical links alone,or introduceguided RF/EM corridors as a complementary in-packagefabric layer?2What Breaks First in Chiplet-Based PackagesCommon Physical Pain Points:Chiplets,HBM,PCIe,SerDesLong in-package links(chipletchiplet,logicHBM,retimed PCIe/SerDes)encounter:Loss scales with dista

4、nce at multi-GHz/multi-Tb/s.Crosstalk/EMI and exploding keep-out zones.Rising SerDes equalization and power overhead.Different protocols-the same physical symptoms in the package.3These“pain corridors”are where multiple protocols collide with the same physical limits inside the package.What Breaks F

5、irst in Chiplet-Based PackagesExample:Chiplet+HBM floorplanLong in-package electrical links consume routing area and enforce large shielded keep-outs,independent of protocol.These long,shared electrical paths becomethe dominant physical bottleneckbeforeprotocol limits are reached.4Typical electrical

6、 channel length for chipletchiplet or logicHBMChiplet floorplanning on an interposer illustrating long electrical channels,shielded keep-outs,and routing congestion.Guided EM Corridors as a Common Transport LegGuided THz/RF Corridors:A Shared Physical ChannelInsert RF/EM“corridors”as guided wave pat