先进封装技术助力人工智能加速.pdf

编号:1011452 PDF 19页 2.35MB 下载积分:VIP专享
下载报告请您先登录!

先进封装技术助力人工智能加速.pdf

1、Advanced Packaging Advanced Packaging Enabling AI Enabling AI AcclerationAcclerationCharles LeeASEAI applications permeating global life,creating new efficiencies and new markets,from data center to edge devices.AI economy projected to soar from$189 billion in 2023 to$4.8 trillion by 2033 a 25-fold

2、increase in just a decade AI adoption could boost global GDP by 15%by 2035,based on game-changing capabilities and safe deployment.Unprecedented data generation is driving global datasphere trajectory towards 200ZB by 2030AI is hereSource:UN Trade and Development(UNCTAD),PwC,IDC 2025Meteroic rise of

3、 top global technology leaders20052005Exxon MobilExxon MobilGeneral ElectricGeneral ElectricGazpromGazpromMicrosoftMicrosoftCiticorpCiticorpBank of AmericaBank of AmericaRoyal Dutch ShellRoyal Dutch ShellBPBPPetro ChinaPetro ChinaHSBCHSBC20252025NVIDIANVIDIAMicrosoftMicrosoftAppleAppleAmazonAmazonAl

4、phabetAlphabetMetaMetaSaudi AramcoSaudi AramcoBroadcomBroadcomTSMCTSMCTeslaTeslaAttributions:Attributions:Cloud Data Centers&NetworkingCloud Data Centers&Networking IoT with Smart DevicesIoT with Smart Devices Autonomous VehiclesAutonomous Vehicles AI to New Interactive GenerationAI to New Interacti

5、ve GenerationSemiconductor Industry ScalingAI innovation ecosystem AI innovation ecosystem is driving the global is driving the global semiconductor market semiconductor market with demand for game with demand for game changing:changing:New equipment New materials New architectureAdvanced Packaging

6、is Advanced Packaging is bringing transformative bringing transformative innovation to address critical innovation to address critical thermal and electrical thermal and electrical challenges:challenges:Heterogenous integrated solutions Power management devices Co-Packaged OpticsAdvantages of System

友情提示

1、下载报告失败解决办法
2、PDF文件下载后,可能会被浏览器默认打开,此种情况可以点击浏览器菜单,保存网页到桌面,就可以正常下载了。
3、本站不支持迅雷下载,请使用电脑自带的IE浏览器,或者360浏览器、谷歌浏览器下载即可。
4、本站报告下载后的文档和图纸-无水印,预览文档经过压缩,下载后原文更清晰。

本文(先进封装技术助力人工智能加速.pdf)为本站 (明日何其多) 主动上传,三个皮匠报告文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知三个皮匠报告文库(点击联系客服),我们立即给予删除!

温馨提示:如果因为网速或其他原因下载失败请重新下载,重复下载不扣分。
客服
商务合作
小程序
服务号
折叠