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11.30 Joost Mulder - Demcon.pdf

上传人: sec****ies 编号:734641 2025-07-26 42页 2.72MB

1、1The role of simulation-driven engineering in semicon challengesJOOST MULDER-MANAGING DIRECTORDemcon multiphysicsApplying fundamental physical insight to generate innovative engineering solutions.AnalyticsBack-of-the-envelope calculationsSimulationsExperiments3High-end engineering services in the fi

2、eld of multiphysics4Fluid flowsHigh-end engineering services in the field of multiphysics5Structural mechanicsHigh-end engineering services in the field of multiphysics6Thermal engineeringHigh-end engineering services in the field of multiphysics7ElectromagneticsHigh-end engineering services in the

3、field of multiphysics8Acoustics&vibrations High-end engineering services in the field of multiphysics9Nuclear physicsHigh-end engineering services in the field of multiphysics10ExperimentsHigh-end engineering services in the field of multiphysics11Product developmentHigh-end engineering services in

4、the field of multiphysics12Active in many different marketsHIGH-TECH SYSTEMS&MATERIALSLIFE SCIENCES&HEALTHAGRI&FOODSMART INDUSTRYAEROSPACEWATER&MARITIMEDEFENSE&SECURITYENERGY13Active in many different marketsHIGH-TECH SYSTEMS&MATERIALSSEMICON14Typical challenges&simulations Operating in vacuum at hi

5、gh temperatures with high precision.Thermomechanical effects Sensor placement Control and dynamics Material handling Advantage of simulations Prevent costly and complex experiments Fast and aimed iterations in design phase Understand separate and combined physicsSEMICON15Practical examples from the

6、chip industryThree examples from our experiences:1.Cu-Cu bonding Machine conditioning2.Panel level packaging warpage prediction3.High precision systems Thermal drift16Cu-Cu bonding Machine conditioning171.Copper-to-copper bonding Copper for 3D-stacking Favorable material properties Elevated temperat

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本文主要介绍了模拟驱动工程在半导体行业挑战中的应用。Demcon multiphysics公司利用物理原理提供创新工程解决方案,服务领域包括多物理场的高端工程服务,如流体流动、结构力学、热工程、电磁学、声学与振动、核物理等。在半导体领域,模拟的优势在于避免昂贵的实验,设计阶段快速迭代,理解不同物理现象的结合。 关键点: 1. 半导体典型挑战与模拟:如高温真空操作、热机械效应、传感器布置等。 2. 实际案例: - 铜铜焊接:通过机器条件处理,实现350秒内达到300ppm O2目标。 - 面板级封装:通过模拟应力与变形分析,预测过度翘曲问题。 - 高精度系统:通过瞬态热行为模拟解决热漂移问题,实现精确放置。 文章强调了模拟在提供复杂物理快速、详细洞察,以及在新概念可行性证明方面的重要性。
"高温下铜腐蚀如何解决?" "如何预测面板级封装的翘曲?" "热漂移影响精度吗?"
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