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10.00 Éricles_Sousa - Universal Chiplet Interconnect Express (UCIe).pdf

上传人: sec****ies 编号:734595 2025-07-26 33页 4.08MB

1、Dr.ricles SousaSoC Architect and UCIe Automotive WG Co-ChairDecember 3,2024Automotive Chiplets in the Era of AI 2024 Cadence Design Systems,Inc.All rights reserved.2 2023 Cadence Design Systems,Inc.Cadence confidential.Internal use only.2What will cars of the future be like?2024 Cadence Design Syste

2、ms,Inc.All rights reserved.3 2023 Cadence Design Systems,Inc.Cadence confidential.Internal use only.3The car of the future will be autonomous,safer,all-electric,fully connected,and cybersecure!2024 Cadence Design Systems,Inc.All rights reserved.4The car of the future will be autonomous,safer,all ele

3、ctric,fully connected,and cybersecure!The 5 Must-Have Features of Modern Automotive SoCsAI-driven ConnectivitySafetyLow-power consumptionReal-Time and High-Performance ComputingCybersecurity 2024 Cadence Design Systems,Inc.All rights reserved.5The car of the future will be autonomous,safer,all elect

4、ric,fully connected,and cybersecure!The 5 Must-Have Features of Modern Automotive SoCsAI-driven ConnectivitySafetyLow-power consumptionReal-Time and High-Performance ComputingCybersecurityComplex and Expensive Monolithic Designs 2024 Cadence Design Systems,Inc.All rights reserved.6 6OutlineDisaggreg

5、ation:The benefits of ChipletsUCIeStandardKey Challenges in Automotive Chiplet-based SoCExamplesSummary 2024 Cadence Design Systems,Inc.All rights reserved.7DisaggregationThe Benefits of Chiplets 2024 Cadence Design Systems,Inc.All rights reserved.8Disaggregation An exampleDisaggregated designs enab

6、ling multi-die package modulesPackageI/OCPURest of SoCGraphicsDie 0Die 1Die 2Die 3PackageI/OCPURest of SoCGraphicsDie 0Die 1Die 2Die 3PackageI/OCPURest of SoCGraphicsDie 0Die 1Die 2Die 3Traditional Monolithic SoCDDR5Processor CoresNPUGPUPCIe,EthernetPower ManagementBus,Network-on-chip,etc.PackageDie

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本文主要讨论了在AI时代,汽车未来发展趋势以及现代汽车系统级芯片(SoC)的关键特性。核心数据包括:80+公司和420+成员加入UCIe汽车工作组,显示了对芯片技术在汽车领域应用的重视。以下是关键点: 1. 未来汽车将是自动驾驶、全电动、完全互联和网络安全。 2. 现代汽车SoC的五个必备特性包括:AI驱动的连接性、安全性、低功耗、实时和高性能计算、网络安全。 3. 提出了基于Chiplets的SoC设计,通过模块化设计提高性能和功能,降低成本。 4. UCIe(通用Chiplet互连快车)作为一种die-to-die互连标准,促进了SoC设计的灵活性和创新。 5. UCIe 1.1规范增加了对汽车应用的支持,如链路健康监测、互操作性和功能安全。 6. 展示了一种通用的基于Chiplets的汽车架构,强调了可扩展性、功能安全性和定制化。 文章强调了Cadence在推动UCIe和Chiplets在汽车行业发展中扮演的领导角色,并提到了与三星、Fraunhofer等机构的合作以及他们在Chiplet技术上的成就。
"未来汽车将如何变革?" "芯片模块化设计如何引领创新?" "UCIe标准对汽车行业意味着什么?"
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