CSET：2022年回流先进半导体封装创新供应链安全和美国半导体领先地位（英文版）（44页）.pdf

1、Policy BriefJune 2022Re-Shoring Advanced Semiconductor PackagingInnovation,Supply Chain Security,and U.S.Leadership in the Semiconductor IndustryAuthorJohn VerWey Center for Security and Emerging Technology|1 Executive Summary In the United States,both the semiconductor industry and the government a

2、re engaged in ambitious plans to expand domestic semiconductor manufacturing capacity.Previous CSET research has covered in detail these efforts to“re-shore”this manufacturing.1 The research found that the Creating Helpful Incentives to Produce Semiconductors(CHIPS)for America Act incentives,if care

3、fully targeted and augmented by adequate regulatory and workforce support,could reverse the observable decline in U.S.semiconductor manufacturing capacity since 1990.This paper expands on that work and argues that targeted investment incentives to increase U.S.-based advanced packaging capacity are

4、also important.Historically,packaging was viewed as a labor-intensive and low value-added“back-end”activity(as opposed to high value-added“front-end”semiconductor fabrication).As a result,firms offshored these activities to overseas locations,primarily in Asia.Two macro trends are driving a change i

5、n how packaging is viewed:First,firms increasingly recognize how important packaging is to processing power,particularly as Moores Law slows.As a result,firms are investing large amounts of capital to develop equipment,materials,and systems that support the advanced packaging ecosystem.Second,innova

6、tion in advanced packaging will be a key determinant of the depth and breadth of innovation in other emerging technologies.This papers key findings and recommendations include:Leadership in advanced packaging is essential for future semiconductor industry competitiveness.As the limits of Moores Law