Aehr Test Systems (AEHR) 2015年年度报告「NASDAQ」.pdf

1、2015 Annual Report Aehr Test Systems FOX-1P Full-Wafer Test System The ABTSTM Advanced Burn-In and Test System is the newest addition to Aehr Tests family of Test During Burn-In systems for packaged parts.It is being used for many applications in the mobility and automotive markets.It can be configu

2、red with up to 320 I/O channels for testing and burning-in advanced logic devices,and it offers an individual device temperature control option for higher-power applications such as applications processors.Aehr Tests patented WaferPakTM Cartridges interface from the FOX-1 or FOX-15 system to the cus

3、tomers wafer to be tested or burned-in.They contain micro-miniature probes to contact all of the die on a wafer in a single touchdown.WaferPak Cartridges are custom designed uniquely for each customer wafer application to interface to the unique pad positions of a wafer design.When used in a FOX sys

4、tem,WaferPak Cartridges enable the production of Known-Good Die(KGD)for use in high reliability and multi-die stacked package applications.The FOX-15 Full Wafer Contact System is designed for single-touchdown testing of up to 15 wafers at a time.Combined with BIST and Design For Test(DFT)on state-of

5、-the-art wafers,the FOX-15 system can be used in a wide range of test and reliability screening(burn-in)applications for devices such as memories,microcontrollers,sensors,VCSELs(laser diodes)and LEDs.It is especially effective for high-reliability applications,such as in the automotive market.PRODUC

6、TS This Annual Report contains certain“forward-looking”statements based on current expectations,forecasts and assumptions that involve risks and uncertainties.Forward-looking statements include statements relating to future market opportunities and conditions,industry growth and customer demand for