Aehr Test Systems (AEHR) 2012年年度报告「NASDAQ」.pdf

1、2012 Annual Report Packaged Part Burn-in Wafer-Level Burn-in Full-Wafer Test The ABTSTM Advanced Burn-in and Test System is the newest addition to our family of Test During Burn-In systems for packaged parts.It can be configured with up to 320 I/O channels for testing and burning-in advanced logic d

2、evices,and offers an individual device temperature control option for high-power applications.It is being used for many applications in the mobile computing and communications and automotive applications spaces.Aehr Tests patented WaferPakTM Cartridges interface from the FOX-1 or FOX-15 system to th

3、e customers wafer to be tested or burned-in.They contain micro-miniature probes to contact all of the die on a wafer in a single touchdown.WaferPak Cartridges are custom designed uniquely for each customer wafer application to interface to the unique pad positions of a wafer design.When used in a FO

4、X system,WaferPak Cartridges enable the production of Known-Good Die(KGD)for use in multi-chip packages.The FOX-15 Full Wafer Contact System is designed for full wafer reliability screening(burn-in),parallel test and process monitoring of up to 15 IC wafers at a time.The FOX-15 system can be used in

5、 a wide range of applications such as memories,microcontrollers,sensors and VCSELs(laser diodes),and is especially effective for high-reliability applications,such as automotive.The FOXTM-1 Full Wafer Parallel Test System is designed to make contact with all die on an IC wafer simultaneously,thus en

6、abling high-throughput massively parallel test of the entire wafer at one time.Since the FOX-1 system can electrically test all of the die on a wafer in a single touchdown,we believe it will significantly reduce the cost of testing wafers.PRODUCTS Except for the historical information contained here