Data Center Modular Hardware System Specification (DC-MHS) the overview.pdf

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1、The Data Center Modular Hardware System specifications have been a smash in the OCP community with great collaboration from industry leaders leading the development of these specifications(AMD,Ampere,Dell,Google,HPE,Intel,Jabil,Meta,Microsoft,and NVIDIA).In this session,the audience will learn the w

2、ho,what,when,where,and why of DC-MHS and at the same time getting an update on progress of each specification.Data Center Modular Hardware System(DC-MHS)Dirk Blevins Sr.Platform Architect,Sr.Principal Engineer Intel CorporationRob Nance Director of Technology Jabil Data Center Modular Hardware Syste

3、m(DC-MHS)SUSTAINABLE SCALABLE COMPUTATIONAL INFRASTRUCTURESERVEROpen Compute Project(OCP)Data Center Modular Hardware System(DC-MHS)SpecificationAccelerate sustainability:Lower carbon footprintRecyclable elements over generationsInventory efficiencyCommon Modular Building Blocks used to create multi

4、ple platforms:Reduce design costFaster time to market Economies of scale Greater design flexibility Enable innovationShort Depth EDGEOCP HyperscaleEnterpriseM-HPMM-FLWM-DNOM-XIOM-CRPSM-PICM-PESTIOCP DC-SCM r2.0OCP NIC r3.0M-SDNOM-SIFM-PnPDC-MHS Building BlocksDC-MHSHPMM-PnPRelatedOCPSpecsM-CRPSM-SIF

5、M-PICM-XIO/M-PESTiBase Building BlocksModular Plug and PlayDC-HPM(Host Processor Module)LeveragedModular Common Redundant Power SupplyeXtended I/O Connectivity&Peripheral Sideband Tunneling InterfacePlatform Infrastructure ConnectivityModular-Shared InFrastructureInitial1.0 SpecificationsReleasedM-S

6、IFSpec 0.3M-SIF Spec 0.75Q2 23Q3 23Q4 23Q1 24Q2 24M-SDNO Spec 0.3M-PIC Spec 1.04M-CRPS 1.04Q1 23Q3 24M-SDNO Spec 0.7M-SIFSpec 0.5M-DNO Spec 1.01M-PESTI Spec 1.1Future Evaluations:Embedded DC-SCMOCP NIC D-SFFEdge-MHSData Center Secure Control ModuleNetwork Interface CardHPMs are comprised of 3 catego