Scalable Optical IO for Disaggregated Infrastructure.pdf

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1、OCP Global Summit October 18,2023|San Jose,CASYM Title SlideLK Bhupathi,Ayar LabsScalable Optical I/O for Disaggregated InfrastructureSYM-Content100s to 1000s xPUs working togetherRadix and throughput demands growing for inter-node connectivityxPU chips to escape multiple TBps to support clusteringS

2、witch chips to offer 10s of TBps of connectivityExample topology shown;other partitions possibleDatacenter Trends Need for Larger Clusters Pooled/Shared DRAM/HBMInter-chassis high throughput low-latency interconnect for pooled/shared memoryCapacity expansion via disaggregation of HBM demands TBps li

3、nks(not shown)Enabling partitioning-flexibility and composability of resourcesExample topology shown;other partitions possibleMemory Pools and Capacity ExpansionApplications and Use-cases of Optical I/OArchitectural Parameter DescriptionApplication requirement or technical capabilityApplication requ

4、irement:Capable and efficient memory-semantic fabrics that deliver scale-out,memory pools,and composability.Technical capabilities:Multi-TB/s connectivity,power-efficiency,BW density,low-latency,and easy-to-manage connectorized fiberUse case Node-node connectivity CXL-based resource disaggregation H

5、BM disaggregation and capacity expansionFuture with Optical I/OTechnology Basics1,000 x smaller than traditional devices WDM for TBps throughput capabilityMicroring ResonatorsTeraPHY chiplet for in-package optical I/ODense 300mm CMOS integrationElectro-Optic ChipletIn-Package IntegrationIntegration

6、with state-of-the-art SoCsDirect from the package optical I/OCapability Scaling(Tx+Rx)Chiplet bandwidth=2*(#of ports/chiplet)x(#of wavelengths/port)x(data rate/wavelength)Chiplet bi-directional BW#of ports/chiplet#of wavelengths/portData rate/wavelength4.096 Tbps(0.5 TBps)8832 Gbps8.192 Tbps(1 TBps)