SESSION 11 - Industry Invited.pdf

1、ISSCC 2024SESSION 11Industry Invited 2024 IEEE International Solid-State Circuits Conference1 of 22Public11.1:AMD InstinctTMMI300 Series Modular Chiplet Package HPC and AI Accelerator for Exa-Class SystemsAMD InstinctTMMI300 Series Modular Chiplet Package HPC and AI Accelerator for Exa-Class Systems

2、Alan Smith,Eric Chapman,Chintan Patel,Raja Swaminathan,John Wuu,Tyrone Huang,Wonjun Jung,Alexander Kaganov,Hugh McIntyre,Ramon Mangaser 2024 IEEE International Solid-State Circuits Conference2 of 22Public11.1:AMD InstinctTMMI300 Series Modular Chiplet Package HPC and AI Accelerator for Exa-Class Sys

3、temsOutline Overview and motivation Logical and physical organization Chiplet modular construction Advanced packaging Power and thermal management Generational scaling 2024 IEEE International Solid-State Circuits Conference3 of 22Public11.1:AMD InstinctTMMI300 Series Modular Chiplet Package HPC and

4、AI Accelerator for Exa-Class SystemsThe AMD Instinct Accelerator JourneyMultiple generations of architecture focused advancing HPC and AI computeMI100AMD CDNA1STDOMAIN SPECIFIC GPU ACCELERATOR FOR COMPUTEDedicated acceleration for compute datatypes FP64|FP32|FP16 for HPC&AIMI200AMD CDNA 21STMCM GPU

5、ACCELERATORDenser compute architecture with leading memory capacity/bandwidthMI300AMD CDNA 3 1STCHIPLET ARCHITECTURE GPU ACCELERATORFocused improvements on Unified memory,AI data format performance and in-node netw 2024 IEEE International Solid-State Circuits Conference4 of 22Public11.1:AMD Instinct

6、TMMI300 Series Modular Chiplet Package HPC and AI Accelerator for Exa-Class SystemsMI300 GPU ACCELERATOR OVERVIEW304 CDNA 3 CU192 GB HBM3 Memory5.3 TB/s Memory Bandwidth228 CDNA 3 CU|24 Zen4 CPU128 GB HBM3 Memory5.3 TB/s Memory BandwidthCPU hosted PCIe accelerator deviceSelf-hosted accelerated proce