P7-【Masayoshi Tarutani】Innovative Technologies of Power Semiconductor Chips and Modules.pdf

1、1CPEEC&CPSSC 2025Innovative Technologies of Power Semiconductor Chips and ModulesDr.Masayoshi TarutaniChief Expert,Power Device Works,Mitsubishi Electric Corporation2025/11/08Please note:No Unauthorized Reproduction of this content.作者授权中国电源学会发布，未经作者同意禁止转载21.Overview of Mitsubishi Electric Power Devi

2、ce Works2.Cutting-edge power semiconductor chip technology (Si-IGBT and RC-IGBT)3.Cutting-edge power semiconductor chip technology (SiC)4.Cutting-edge power module technology5.Features&application fields of the latest power module products6.Conclusion议程AgendaCPEEC&CPSSC 2025Please note:No Unauthoriz

3、ed Reproduction of this content.作者授权中国电源学会发布，未经作者同意禁止转载Mitsubishi Electric CorporationOverview of Mitsubishi Electric Power Device Works13CPEEC&CPSSC 2025Please note:No Unauthorized Reproduction of this content.作者授权中国电源学会发布，未经作者同意禁止转载Mitsubishi Electric CorporationMitsubishi Electric Power Device Wo

4、rks&manufacturing sites1-14Surface side Back sideMitsubishi PDW(Fukuyama,Hiroshima pref.)(DIPIPM,Modules for Automotive）Mitsubishi PDW(Kita-Itami)Bldg.U(DIPIPM,Modules for Industry&Automotive）Mitsubishi PDW(Kumamoto)(Mother Factory）Mitsubishi PDW(Kumamoto)Foundry(Domestic/Overseas)Surfaceprocess Mit

5、subishi PDW(Kumamoto,Kitaitami,Fukuyama)Back sideprocessAs of Oct.1,2025*Mitsubishi+MEPCSi 200mmSi 125mmSiC 150mmFront SideProcessBack SideProcessBack SideProcessSi 300mmSi 200mmBack SideProcessNew Wafer Fab（Kumamoto,Shisui）Completed ImageConstruction mostly completedSiC 200mm 500kmSi 200mmCPEEC&CPS

6、SC 2025Please note:No Unauthorized Reproduction of this content.作者授权中国电源学会发布，未经作者同意禁止转载Mitsubishi Electric CorporationPower Device Works New buildings/Investment Plan1-25New Factory buildings for wafer process and module assembly&test/inspection:-A new Facility for the SiC 8-inch wafer process has b