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Mario-Orgis-LMS.pdf

上传人: 芦苇 编号:1146345 2026-02-14 11页 4.04MB

1、Smart Edge(AI)Long Range ConnectivityUltra low-cost,secure&reliable System-on-Chip based on the first global-free,non-cellular 5G standard enablingwww.lm-About us:Fabless Semiconductor Company Founded in 2022,based in Dresden the heart of Silicon Saxony Currently 25+team(40+FTEs)including five PhDs

2、and over 250+years of combined semiconductor&wireless experience.Teams:System design,RFIC,Digital Design,Firmware Founders:Christoph Gulich(CEO),Mario Orgis(CTO)We are last mile semiconductor.We are developing an ultra-low-power,cost-effective wireless System-on-Chip that combines cellular 5G perfor

3、mance with Bluetooth-level energy efficiency,using the new non-cellular 5G NR+standard.One chip empowering digital sovereignty in our hyperconnected future.+Secure,energy-efficient,and reliable connectivity over large areas(smart meters,sensors,gateways,controllers,etc.).Long Range,a missed feature

4、in IoT?By now!We as DECT Forum can position NR+as the leading Long Range technology Lets Do it together!+NR+delivers a globally interoperable,IP-native long-range standard.While todays LPWAN technologies are constrained by frequency limits,fragmentation,and proprietary architectures.Cellular 4G/56+L

5、ow-cost+Data rate 1 Mbit/s+Long Range+No Interferences+ScalabilityWi-Fi+No operatorZigbeeBluetooth+Free Dedicated spectrum+World-wide(incl.Europe)+Low-Latency+End-to-end securitySigfoxNo networks for reliable IoT connectivity are available yet.Product Offering:LM10XX PlatformOur LM10XX is a single-c

6、hip solution combining an ultra-low-power RISC-V core with a high-performance multiband NR+radio and integrated Edge AI capabilities to deliver reliable and secure connectivity.Built on 22nm FDSOI technology,it enables a new generation of energy-efficient and intelligent wireless devices.Key feature

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1. 公司概况:LMSemi成立于2022年,总部位于德国德累斯顿,拥有25+团队(40+ FTEs),核心团队具备250+年半导体与无线经验。 2. 技术核心:开发基于非蜂窝5G NR+标准的SoC(LM10XX平台),结合5G性能与蓝牙级能效,支持6km长距离(23dBm TX功率)及Edge AI。 3. 产品特点: - 22nm FDSOI工艺,集成RISC-V核心、多频段NR+射频、安全单元及Zephyr SDK。 - 三款型号:LM10LE-56(大规模物联网)、LM10ME-84(智能计量)、LM10HE-121(边缘AI视频)。 4. 优势:全球免费频谱(1.9GHz)、无蜂窝运营商依赖、抗干扰、低延迟,满足专业IoT安全与成本需求。 5. 路线图:2023年原型,2027年LM20XX发布,目标赋能数字主权与超连接未来。
**5G芯片优势?** (吸引关注技术突破的受众,突出NR+标准与传统技术的差异) **超低功耗如何实现?** (针对能源敏感型应用场景,引发对芯片设计的兴趣) **数字主权靠什么?** (强调安全与自主性,吸引关注数据隐私和供应链安全的决策者)
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