当前位置:首页 >财报库 > 报告详情

应用材料Applied Materials(AMAT)2026财年第一季度业绩电话会纪要「NASDAQ」(英文版)(6页).pdf

上传人: 1****1 编号:1124633 2026-02-13 6页 129.31KB

下载:

1、Q1 Fiscal 2026 Earnings Call PREPARED REMARKS|FEBRUARY 12,2026 PAGE|1 APPLIED MATERIALS EXTERNAL MIKE SULLIVAN|Corporate Vice President,Investor Relations Good afternoon everyone and thank you for joining todays call.With me are Gary Dickerson,our President and CEO,and Brice Hill,our Chief Financial

2、 Officer.Before we begin,Id like to remind you that todays call includes forward-looking statements which are subject to risks and uncertainties that could cause our actual results to differ.Information concerning these risks and uncertainties is discussed in our most recent form 10-K and other fili

3、ngs with the SEC.Todays call also includes non-GAAP financial measures.Reconciliations to GAAP measures can be found in todays earnings press release and in our quarterly earnings materials,which are available on our website at .Before we begin,I have several calendar announcements.On Tuesday mornin

4、g,February 24th,Applied will host new product briefings at the SPIE Lithography and Patterning conference in San Jose,and you are welcome to join us in person.We are also very pleased to announce the first event in our 2026 Master Class series.We plan to cover transistors and wiring on Wednesday,Apr

5、il 8th at 9:00 a.m.,Pacific Time,and will host a live Webcast.Finally,we are excited to announce two special events during SEMICON West.On Monday afternoon,October 12th,we plan to host an investor open house event at the new EPIC Center in Silicon Valley,California.We hope youll join us there.And on

6、 Tuesday morning,October 13th,we plan to host an investor breakfast in San Francisco.We hope to see you in person or on the webcast.And with that introduction,Id now like to turn the call over to Gary Dickerson.GARY DICKERSON|President and Chief Executive Officer Thank you,Mike.In our first fiscal q

word格式文档无特别注明外均可编辑修改,预览文件经过压缩,下载原文更清晰!
三个皮匠报告文库所有资源均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
1. **业绩与增长**:2026财年Q1营收70亿美元(指引上限),同比降2%;非GAAP每股收益2.38美元(指引上限),同比持平。预计2026年半导体设备业务增长超20%,2027年势头强劲。 2. **市场驱动**:AI计算加速推动半导体行业2026年营收或达1万亿美元,领先逻辑、HBM DRAM和先进封装为关键增长领域。 3. **创新与产品**:推出V™、Sym3™ Z Magnum™等新产品,冷场发射e-beam技术收入预计翻倍至超10亿美元;EPIC合作平台将加速技术转化。 4. **财务指引**:Q2营收预期76.5±0.5亿美元,环比增9%;非GAAP EPS 2.64±0.2美元,毛利率升至约49.3%。 5. **服务与效率**:服务业务收入创纪录(15% YoY增长),AIx™软件提升产能30%;供应链库存增加5亿美元以支撑需求。
AI驱动增长? 半导体前景如何? 创新战略揭秘?
客服
商务合作
小程序
服务号
折叠