面向可持续性的硬件设计.pdf

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1、Hardware Design for SustainabilityEmre Tepedelenlioglu-Systems Engineer,MetaSanjay Gupta-TPM,MetaSUSTAINABILITYData Center&Network Infrastructure EmissionsDEC:Building DCsIT HW (i.e.Racks)in DCs Network:Connecting DCsSCOPE 1:Covers direct emissionsthat come from sources that are owned and/or control

2、led by Meta.SCOPE 2:Covers indirect emissionsfrom the purchased or acquired energy consumed by Meta.SCOPE 3:IndirectEmissions other than Scope 1&2 that occur in Metas value chain.Typical OCP Rack Emissions BreakdownAs of Sep2025,Compute Trays are estimated to be the single largest contributors to Sc

3、ope 3 emissions on general purpose computer racks.Silicon components(CPU,DIMM)are largest contributors to Scope 3 emissions on a Compute TrayThis slide contains modeled emissions for select hardware using data from Sept 25 and is subject to change in the futureScope 3 Emissions Different OCP Rack Ty

4、pesAI(GPU)Warm StorageCold StorageGeneral Purpose ComputeNote:This slide contains modeled emissions for select hardware using data from Sept 25 and is subject to change in the futureDesign for Sustainability(DFS)is a set of guidelines that are intended to aid HW designers reduce the environmental im

5、pact of their IT racks by focusing on energy efficiency,material selection and reduction,circularity,and end-of-life disposal.Design for SustainabilityAdditional Details in the Meta Engineering Blog at https:/ for Emissions ReductionsLow Carbon/Recycled MaterialsRe-use,Useful Life ExtensionDesign Im

6、provementsSupplier Engagements1.Low Carbon Steel2.Recycled Aluminum3.Recycled Copper4.PCB with lower carbon materials(recyclable materials,PLA)1.Design for component reuse(Riser cards,Drives,GPUs,Switches,Pluggable optics2.Standardized form factors for reusing racks and mechanica