跳出机架思维：利用光互连实现规模化扩展.pdf

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1、Sam Kocsis,AmphenolDirector of Standards and TechnologyThinking Outside the Rack:Scaling Up with Optical InterconnectsThinking Outside the Rack:Scaling Up with Optical InterconnectsSam Kocsis,AmphenolExtending PCIe Connectivity(an OCP effort)Passive Copper up to 1mActive Copper up to 3mOptics up to

2、7-12mSource:OCP PCIe Extended Connectivity Requirements 1.0StorageMemoryCompute FabricsWhy Short Reach Optics?NetworkingServerStoragePower/MgmtNetworkingComputeStoragePower/MgmtAcceleratorsMemoryScale-UpRack ArchitecturesScale-OutWhy Short Reach Optics?CPOBeachfront DensityPowerSerDes ReachPluggable

3、 ModulesReliabilityCostPhysical Reach/LatencyStandardization TrendsIEEE Project“3bj/by”“3cd”“3ck”“3dj”“3xx”Per-lane Data Rate25G50G100G200G400GModulationNRZPAM-4PAM-4PAM-4PAM-xCopper Reach5m3m2m1mx mOptical Host8.5dB8.5dB13.5dB28.2dB*xx dBPCI-SIG Project“Gen4”“Gen5”“Gen6”“Gen7”“Gen8”Per-lane Data Ra

4、te16G32G64G128G256GModulationNRZNRZPAM-4PAM-4PAM-4Copper Reach2.5m2m2m1mx mOptical Host-36dB32dB*36dB*xx dBNetworkingCompute*Die-to-die IL budget*Die-to-die IL budget,retimer requiredOptical ImplementationsLPO technology demo of OSFP800G-DR8Supporting more than 20dB loss from ASIC to connector with

5、BER 36dB and BER 1E-6Host Channel ImplementationsRack ImplementationsOCP OAI 2.0(2023)8 XPUs 10kWTotal Power(kW)GPUs per RackDeployment TrendsScale-UpScale-OutScale-AcrossExpansion ArchitectureVerticalIntra-rackHorizontalInter-rackVertical+HorizontalInter-clusterApplicationCompute Fabrics+Storage/Me

6、moryData Center FabricsGlobal FabricsTransmission Distance10m10s-100s of m2km+Transmission MediumCopperOpticsOpticsTransmission TechnologyNVLink,UALink,SUEPCIe,CXLInfiniBand,UEC,SUEEthernet*Ethernet-like protocolFuture Standardization Effor