芯片翘曲变化对导热界面材料热性能的影响.pdf

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1、Yin Hang(Meta)Willie TY Chen(Wiwynn)Impact of Die Warpage Changes on TIM Thermal PerformanceImpact of Die Warpage Changes on TIM Thermal PerformanceYin Hang(Meta)Willie TY Chen(Wiwynn)COOLING ENVIRONMENTS&LIQUID COOLINGIntroductionWhen using a bare die package,as the package size increases,we observ

2、e that over 30%of the total thermal resistance originates from the thermal interface material.Goal:Survey various types of Thermal Interface Materials(TIMs)and benchmark their performance against Phase Change Material(PCM)Testing Unit:Copper TTV(700W):Used for TIM survey Real GPU(700W):Used for quan

3、tify the TIM performance in a real chip environmentTest Condition:PG25,Flowrate 11.6 LPM/GPU 30 C coolant inlet temperatureStudy OverviewTIMPCM-1PCM-2GraphitePC-Metal Foil(In+Bi+Sn)Pure LMT-1(Ga+In)Pure LMT-2(Ga+Sn+In)K(W/m-K)8.57.54218*28*26Rank453612SetupTTV setupGPU setup11.6LPM 30Cwith PG25Desig

4、n a groove along the side of the cold plate to avoid interferenceHeat TransferTesting SetupThermal resistance of cold plateCoolant Supply Temp(from RPU)TTV Case Temp.Cold plate bottom Case Temp.Thermal resistance of TIMDesign a groove along the side of the cold plate to avoid interferenceHeat Transf

5、erThermal resistance of cold plateCoolant Supply Temp(from RPU)GPU Junction Temp.Cold plate bottom Case Temp.Thermal resistance of TIM+GPU11.6LPM 30Cwith PG25GPUTo select the appropriate thermal interface material(TIM),we typically compare the thermal conductivity values listed in the datasheet and

6、use thermal test vehicles(TTV)to quantify thermal performance.However,certain types of TIM may exhibit different performance in actual chip applications compared to results obtained from TTV testing.For example,in our study:1.Phase Change Metal Foil TIM performs well under TTV testing but the perfor