提高E1.S模块液冷效率和可维护性的冷板设计考虑因素.pdf

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1、Dennis Trieu/MicrosoftNENG CHIEH CHANG(Jerry)/WiwynnCold Plate Design Considerations for Improving Liquid Cooling Efficiency and Serviceability in E1.S ModulesCold Plate Design Considerations for Improving Liquid Cooling Efficiency and Serviceability in E1.S ModulesDennis Trieu(Microsoft)NENG CHIEH

2、CHANG(Wiwynn)COOLING ENVIRONMENTS&LIQUID COOLINGFull Liquid Cooling Trends:Eco-FriendlyNew Data Center InfrastructureFull Liquid Cooling Challenges in E1.S Cooling Solution:Complex Geometry and E1.S Form FactorThermal CapabilityHot-swap FeasibilityE1.S Cold Plate Design:Elastic Interface MechanismFl

3、ow Channel ArchitectureOutlineEco-Friendly:Superior heat transfer Reduces power usage and PUELiquid Cooling TrendsNew Data Center Infrastructure:With AI racks adopting liquid cooling,expanding its coverage is emerging as a key industry trend.Liquid Cooling Solution TypesHybrid SolutionFull liquid co

4、oling SolutionLiquid cooling targets high-power components.Airflow removes heat from low-power components.Liquid cooling coverage approaches 100%.Fan power consumption is reduced or zeroedEnables denser platform designsWell-suited for next-generation datacenter infrastructure.Full Liquid Cooling Cha

5、llengesChallenges of Full liquid cooling SolutionWithout airflow,additional cooling methods are required for various small components(e.g.,DIMMs,E1.S,etc.).Cold plates are essential where natural convection and/or radiation is insufficient.Special Focus-E1.S Module:Dual-sided heat generation require

6、s the cold plate to contact the E1.S with TIM sandwiched in between.E1.S must be front panel serviceable and hot-swappable.Front viewCold plate wallTIME1.SHeat source Dual-sided heat generation of E1.SsComplex Geometry and E1.S Form Factor:Challenges of E1.S cooling solution E1.S modules are densely