超越 ORv3 HPR 母线：利用液冷技术实现下一代 AI 机架功率等级.pdf

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1、Hal LoketSystem Architect at TE ConnectivityBeyond ORv3 HPR Busbars:Enabling Next Gen AI Rack Power Levels with Liquid CoolingBeyond ORv3 HPR Busbars:Enabling Next Gen AI Rack Power Levels with Liquid CoolingLily Zhang,Product Manager,TE ConnectivityBrian Costello,System Architect,TE ConnectivityRog

2、er Luo,Mechanical Engineer,TE ConnectivityDmitriy Shapiro,Mechanical Engineer,MetaJohn Fernandes,Thermal Engineer,MetaHal Loket,System Architect,TE ConnectivityDATA CENTER(DC)PHYSICAL INFRASTRUCTUREBackground Liquid cooled busbar design conceptTesting&simulation dataSafety criteria&testingCall to ac

3、tionOverviewRack level power requirements continue to riseAI load requirements already exceeding air cooling limits for ORv3 HPRLatest GPU releases require liquid coolingIncorporate liquid cooling technology to the busbar by leveraging existing infrastructure LC busbar increases current carrying cap

4、acity in same footprint by 5xAllows for improved thermal performance of mating busbar connectorsORv3 HPR BackgroundRack Power(kW)0200400600800100012001400160018002000ORv2ORv3ORv3 HPR2027 AI Racks 2029 AI RacksDesign Considerations Temperature rise-30C MaxVoltage drops-0.1V MaxThermal Interface Mater

5、ial-Thermal conductivity,electrical insulation,ease of assemblySafety-No contact between liquid and copperServiceability-Quick connectionsMass-Reduce as much as possibleReliability-No leakageCold Plate Design-Maximize cooling capability,maintain manufacturability and qualityHose Connections-Standard

6、ization,supply chain,ease of assemblyRack Mounting&Disruption-Maintain profile as close as possible to standardLiquid Cooled Busbar Design OverviewWarm Coolant Outlets(Shown at the Top)Chilled Coolant Inlets(Shown at the bottom)Full Rack HeightVertical BusbarCoolant Channel for Ground Return BusbarC