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1、Kasper Wszolek,Principal Engineer,IntelBharat Pillilli,Principal HW Engineer,MicrosoftJanusz Jurski,Principal Engineer,IntelOpen Boot&Management Framework-on the mission for Universal,Vendor Agnostic DC-SCMOpen Boot&Management Framework-on the mission for Universal,Vendor Agnostic DC-SCMKasper Wszol
2、ek,Principal Engineer,IntelBharat Pillilli,Principal HW Engineer,MicrosoftJanusz Jurski,Principal Engineer,IntelSYSTEMS MANAGEMENTBackground2023/202420222021/2022DCDC-SCM 2.0SCM 2.0Contributed by 16 companiesLTPI consolidates platform-level interfaces consolidationDCDC-MHS SpecsMHS SpecsStandardized
3、 Platform HW ModularizationElectro-mechanical Specs.PCIPCI-SIG,DMTFSIG,DMTFInterface consolidation and industry alignment Long-term OOB Management alignment around SMBus/I3C+USB and MCTP/PLDM2024MHS Plug&PlayMHS Plug&PlayDC-SCM and HPM HW Abstraction SpecsPlatform FW Configuration Alignment between
4、DC-SCM and HPM Vendors2025Coming up nextComing up nextMCTP over USB Binding improvements(v1.1)Multi-Node Systems(DC-SCM 3.0)Open Boot and Management FrameworkManagement Interoperability StackElectro-Mechanical Interoperability:-HW Discovery&ProtectionFW Interoperability:-Platform FW Configuration&En
5、abling SoC Vendor Interoperability:-Standardized SoC Boot&Mgmt.Interface/ProtocolsM-FLWM-DNOM-XIOM-PICDC-SCMOCP NICM-PESTIM-CRPSPnP JSONSchemaFPGAJSONHPMJSONPeripheralsJSON?Problem Statement ProprietaryMulti-Protocol&Multi-Interface Problem limits FW interoperability between CPU/Device vendors.Opene
6、SPIQSPI/SPII2CStandardClosedI3CUSBSMBusGPIODC-SCMHPM ADC-SCIBMCCPU orDeviceVendor AMulti-ProtocolsMulti-InterfacesInterfaces X,Y,ZProtocols A,B,CDC-SCMHPM BDC-SCIBMCCPU orDeviceVendor BInterfaces X,Q,YProtocols C,D,EDC-SCMHPM CDC-SCIBMCCPU orDeviceVendor CInterfaces W,Y,ZProtocols A,K,LOBMF-Open Boo