晶圆级封装（RDL）-行业数据-三个皮匠报告

图7：台积电的CoWoS-L（LSI，本地硅互连 + RDL中介层）

行业数据 2026-04-20

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图34、RDL技术的工艺流程（以电镀法为例）

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

行业数据 2025-11-10

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图表41台积电集成扇出型（InFO）晶圆级封装

fCDlsIHoo4XnsbvlnosgICB8IOe7hOaIkOe7k+aehCAgICAgICAgICAgICAgIHwKfC0tLS0tLS0tLS0tLXwtLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS18CnwgSW5GTyAtIFBvUCB8IERSQU0gKyBMb2dpYyAgICAgICAgICAgfAp8IEluRk8gLSBvUyAgfCDlpJrkuKpMb2dpYyArIFN1YnN0cmF0ZSAgfAoK6LWE5paZ5p2l5rqQ77ya5Y+w56ev55S15a6Y572R77yM5Y2O5Yib6K+B5Yi4

行业数据 2025-08-27

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RDL层和C4/底部填充（UF）层提供缓冲

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

行业数据 2025-08-12

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晶圆级芯片尺寸封装技术与传统封装技术对比

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

行业数据 2025-07-15

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晶圆级项目产能规划与原IPO项目对比

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

行业数据 2025-06-09

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扇出型晶圆级封装（FOWLP）过程

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行业数据 2025-04-24

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WLP2000晶圆级封装直写光刻机

| 图表83: WLP 2000 晶圆级封装直写光刻机 |  |
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行业数据 2025-04-18

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扇出型晶圆级芯片封装（Fan-outWLCSP）工序

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行业数据 2025-04-07

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普通封装与晶圆级封装对比

55Sx5LqO5Zu+54mH5Lit55qE5pWw5o2u5peg5rOV6K+G5Yir77yM5oiR5bCG5peg5rOV5Li65oKo55Sf5oiQ5pWw5o2u6KGo5qC844CC5aaC5p6c5oKo6IO95o+Q5L6b5pWw5o2u77yM5oiR5bCG5b6I5LmQ5oSP5biu5Yqp5oKo55Sf5oiQ6KGo5qC85bm25Zyo5LiL5pa55bGV56S66LWE5paZ5p2l5rqQ44CC

行业数据 2025-02-21

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重新分布层（RDL）结构

fCDph43luIPnur/lsYLkuI7lh7jlnZfkvqfpnaLop4blm74gfCDph43luIPnur/lkI7oiq/niYfov57mjqXpnaLop4blm74gfAp8LS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS18LS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS18Cnwg6YeN5biD57q/ICAgICAgICAgICAgICAgICAgIHwg54SK55CD5Ye45Z2XICAgICAgICAgICAgICAgICB8Cnwg6YeR5bGe6Kem54K5ICAgICAgICAgICAgICAgICB8IFVCTSAgICAgICAgICAgICAgICAgICAgICB8Cnwg5pm25ZyGICAgICAgICAgICAgICAgICAgICAgfCAgICAgICAgICAgICAgICAgICAgICAgICAgfAoK6LWE5paZ5p2l5rqQ77ya54ix6YKm5Y2K5a+85L2T572R44CB5Y2O6YeR6K+B5Yi456CU56m25omA

其它 2024-07-16

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扇入型与扇出型RDL对比

5oqx5q2J77yM5oiR5peg5rOV5o+Q5Y+W5Zu+54mH5Lit55qE5pWw5o2u44CC6K+35o+Q5L6b5paH5pys5L+h5oGv77yM5oiR5bCG5biu5Yqp5oKo55Sf5oiQ6KGo5qC85ZKM5bGV56S66LWE5paZ5p2l5rqQ44CC

其它 2024-07-16

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重布线层（RDL）将I/O重新分配到芯片边缘

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

其它 2024-07-11

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重布线层（RDL）关键工序流程主要由十个步骤组成

fCDmraXpqqQgfCDmj4/ov7AgfAp8IC0tLSB8IC0tLSB8CnwgMSB8IOmSneWMluWxgua2guW4gyB8CnwgMiB8IOWFieWIu++8iOabneWFie+8iSB8CnwgMyB8IOWFieWIu++8iOaYvuW9se+8iSB8CnwgNCB8IOayieenr+mHkeWxnuWxgu+8iFVCTe+8iSB8CnwgNSB8IOeUtemVgO+8iFJETOmHkeWxnue6v++8iSB8CnwgNiB8IOWFieWIu++8iOabneWFie+8iSB8CnwgNyB8IOWFieWIu++8iOaYvuW9se+8iSB8CnwgOCB8IOWFieWIu+acuua2guW4gyB8CnwgOSB8IOWOu+mZpOWFieWIu+iDtiB8CnwgMTAgfCDljrvpmaTlhYnliLvog7YgfAoK6LWE5paZ5p2l5rqQ77yaTEIgU2VtaWNvbg==

其它 2024-07-11

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各类型先进封装主要包含bumping、RDL、TSV及键合等互连工艺

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

其它 2024-07-11

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晶圆级封装（RDL）

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