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重布线层(RDL)关键工序流程主要由十个步骤组成
重布线层(RDL)关键工序流程主要由十个步骤组成
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所属报告:
电子行业深度报告:先进封装助力产业升级材料端多品类受益-240709(48页).pdf
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图7:台积电的CoWoS-L(LSI,本地硅互连 + RDL中介层)
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行业数据
2026-04-20
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图34、RDL技术的工艺流程(以电镀法为例)
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行业数据
2025-11-10
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RDL层和C4/底部填充(UF)层提供缓冲
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行业数据
2025-08-12
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重新分布层(RDL)结构
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其它
2024-07-16
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扇入型与扇出型RDL对比
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其它
2024-07-16
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重布线层(RDL)将I/O重新分配到芯片边缘
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其它
2024-07-11
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各类型先进封装主要包含bumping、RDL、TSV及键合等互连工艺
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其它
2024-07-11
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RDL工艺流程及所用材料
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其它
2024-02-02
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铜电镀RDL工艺步骤及所需材料
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其它
2024-01-30
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图28.RDL在CoWos-R封装结构中的应用
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其它
2024-01-10
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2.5DXDFOI中RDL层分解
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其它
2023-12-28
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晶圆级封装(RDL)
fCDmmbblnIbnuqflsIHoo4XvvIhSREzvvIkgfCDph4fnlKhSREzmioDmnK/nmoToiq/niYcgfCDoiq/niYfliZbpnaLlm74gfAp8LS0tLS0tLS0tLS0tLS0tLS0tfC0tLS0tLS0tLS0tLS0tLS0tLXwtLS0tLS0tLS0tfAp8IOWOn+Wni+eEiuebmCAgICAgICAgIHwg6YeN5paw5YiG6YWN6L2o6L+5ICAgICB8IOesrOS6jOS4queUteWxgiB8Cnwg5paw6ZSu5ZCI54SK55uYICAgICAgIHwg6L2o6L+5ICAgICAgICAgICAgIHwg5byV57q/6ZSu5ZCI54SK55uYIHwKfCAgICAgICAgICAgICAgICAgIHwgQUnnhIrnm5ggICAgICAgICAgIHwg56ys5LiA5Liq55S15bGCIHwKfCAgICAgICAgICAgICAgICAgIHwgUElRL1BJWCAgICAgICAgICB8ICAgICAgICAgIHw=
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其它
2023-12-13
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图表42.WLP采用RDL、TSV和Micro-bump工艺
fCDpobnnm64gfCDop6Pph4ogfAp8LS0tLS0tfC0tLS0tLXwKfCBXTFAgfCDlhYjov5vlsIHoo4XmioDmnK8gfAp8IFJETCB8IOmHjeW4g+e6v+WxgiB8CnwgVFNWIHwg56GF6YCa5a2UIHwKfCBNaWNyby1idW1wIHwg5b6u5Ye45Z2XIHwKfCBDaGlwIEEgfCDoiq/niYdBIHwKfCBDaGlwIEIgfCDoiq/niYdCIHwKfCBTdWJzdHJhdGUgfCDln7rmnb8gfAp8IEluRk8gfCDnhIrnkIPpmLXliJflsIHoo4UgfAoK6LWE5paZ5p2l5rqQ77ya5Y+w56ev55S15a6Y572R77yM5Lic5Lqa5YmN5rW36K+B5Yi456CU56m25omA
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2023-03-20
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电子行业深度报告:先进封装助力产业升级材料端多品类受益-240709(48页).pdf
溅射靶材的种类众多
国内电镀液厂商正向先进封装领域进发
光敏聚酰亚胺亦有正负性之分,且正性PSPI性能更为优越
混合键合在存储与逻辑应用领域均有技术突破
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