20250122_K-4_Basoco.PDF

1、ConfidentialThe Right Testing Strategy Can Save DesignsJanuary 2025ConfidentialComplexity Is Increasing Exponentially200565nmEra of Capital Efficiency201028nm100 Staff Yrs201514nm200 Staff Yrs20205nm1,000 Staff Yrs 20252-3nm2,000 Staff Yrs$ConfidentialComplexity Is Increasing Exponentially200565nmEr

2、a of Capital EfficiencyEra of Complexity201028nm100 Staff Yrs201514nm200 Staff Yrs20205nm1,000 Staff Yrs 20252-3nm2,000 Staff Yrs$ConfidentialChiplets WILL be EverywhereSource:Yole ResearchConfidentialTest Flow Tradeoffs in the Era of ComplexityEra of Capital EfficiencyWafer SortBurn In*Final TestCo

3、nfidentialTest Flow Tradeoffs in the Era of ComplexityEra of ComplexityWafer SortBurn In*Final TestSLTDLPMATSystem Level TestDie Level ProbeMid-Assembly TestConfidentialTESTABILITYTESTABILITYDEBUGABILITYDEBUGABILITYOBSERVABILITYOBSERVABILITYRELIABILITYRELIABILITYVulnerabilityFROM MONOLITHIC DIE TO C

4、HIPLET DEVICE ConfidentialDie MatchingThermal ManagementAdvanced Packaging Test ChallengesFROM MONOLITHIC DIE TO CHIPLET DEVICE Known Good Die Interposer Substrate StackConfidentialSi D vic A ump i n:Wha in i f hi pacakge anyways?HBMHBMHBMHBMWafer Process Node:5nmDie Size:Max Reticle#of Die/Final Pk

5、g:2GDPW:80HBM Type:3E#of die/stack:8#of stacks:4Package&Assembly Type:CoWoSSubstrate:YInterposer:YDevice:LagunaConfidentialaSub-module:$7kWafer Cost:$14kCost Assumptions:How MUCH does that Cost?Package&Assembly:$400NOTE:Costs are ballpark estimates Test Cell:$150-250/hrorHBM Stacks:$680aSystem Level

6、 Test:$450/hrConfidentialWafer FabricationWafer SortAssemblySi Device Laguna Production Flow EstimatesSLT SLT Temp TT:30min Yield:97.5%FT1 FT1_Temp TT:300s Yield:95%FT2 FT2_Temp TT:500s Yield:98%WS1 WS1_Temp TT:120s Yield:35%WS2 WS2_Temp TT:60s Yield:95%Final TestSystem Level TestConfidentialWafer F