1、2020 Annual ReportAehr Test Systems FOX-XP Wafer Level Test&Burn-in SystemProduction Test and Burn-in of Silicon Carbide Devices for Electric Vehicles and Silicon Photonics Devices for Data Center and 5G Infrastructure at Full Wafer Level(in thousands,except per share data)For the years ended May 31
2、,2020 2019 2018 Net sales$22,291$21,056$29,555(Loss)income from operations (2,765)(5,000)915 Net(loss)income attributable to common shareholders (2,802)(5,235)528 Net(loss)income per share-diluted (0.12)(0.23)0.02 Cash and cash equivalents 5,433 5,428 16,848 Working capital 13,786 14,522 18,308 Shar
3、eholders equity 14,056 15,453 19,285 The ABTSTM Advanced Burn-In and Test System is Aehr Tests family of Test During Burn-In systems for packaged parts.It is being used for many applications in the mobility and automotive markets.It can be configured with up to 320 I/O channels and up to 72 Burn-in
4、boards for testing and burning-in advanced logic devices.It offers an individual device temperature control option for higher-power applications such as applications processors.Aehr Tests patented WaferPak Contactor and DiePakCarriers connect electrical test resources from Aehrs FOX systems to the c
5、ustomers wafer or singulated die/modules to be tested or burned-in.Both products contain micro-miniature probes to contact all the die/modules in a single insertion.The FOX-P platform can be used in a wide range of test and reliability screening(burn-in)applications for high reliability applications
6、,such as automotive,mobile devices,networking,telecommunications,sensors,photonics and laser devices.The FOXTM-XP Burn-in and Test System is designed for single-touchdown testing of up to 18 wafers at a time and for testing singulated die or small modules.The FOX-NP is a low-cost entry-level system