Aehr Test Systems (AEHR) 2018年年度报告「NASDAQ」.pdf

1、2018 Annual Report Aehr Test Systems FOX-XP Multi-Wafer Test&Burn-in System&WaferPak Full Wafer Contactor(in thousands,except per share data)For the years ended May 31,2018 2017 2016 Net sales$29,555$18,898$14,501 Income(loss)from operations 915 (4,929)(6,154)Net income(loss)attributable to common s

2、hareholders 528 (5,653)(6,785)Net income(loss)per share-diluted 0.02 (0.35)(0.52)Cash and cash equivalents 16,848 17,803 939 Working capital 18,308 21,494 4,068 Shareholders equity(deficit)19,285 16,794 (723)The ABTSTM Advanced Burn-In and Test System is the latest product in Aehr Tests family of Te

3、st During Burn-In systems for packaged parts.It is being used for many applications in the mobility and automotive markets.It can be configured with up to 320 I/O channels and up to 72 Burn-in boards for testing and burning-in advanced logic devices.It offers an individual device temperature control

4、 option for higher-power applications such as applications processors.Aehr Tests patented WaferPak Cartridges and DiePak Carriers connect electrical test resources from Aehrs FOX systems to the customers wafer or singulated die/modules to be tested or burned-in.Both products contain micro-miniature

5、probes to contact all the die/modules in a single insertion.WaferPak Cartridges and DiePak Carriers are custom designed for each customers unique application.When used in a FOX system,both configurations are capable of supplying power and removing up to 2kW of heat energy per WaferPak Cartridge or D

6、iePak Carrier.The FOXTM-XP Burn-in and Test System,publicly introduced in July 2016,is designed for single-touchdown testing of up to 18 wafers at a time and for testing singulated die or small modules.A single test cell with a WaferPakTM Aligner and three FOX-XP systems can test up to 54 wafers at