Aehr Test Systems (AEHR) 2013年年度报告「NASDAQ」.pdf

1、2013 Annual Report Aehr Test Systems FOX-15 Wafer-Level Test and Burn-In System Installation The ABTSTM Advanced Burn-In and Test System is the newest addition to Aehr Tests family of Test During Burn-In systems for packaged parts.It is being used for many applications in the mobility and automotive

2、 markets.It can be configured with up to 320 I/O channels for testing and burning-in advanced logic devices,and it offers an individual device temperature control option for higher-power applications such as applications processors.Aehr Tests patented WaferPakTM Cartridges interface from the FOX-1 o

3、r FOX-15 system to the customers wafer to be tested or burned-in.They contain micro-miniature probes to contact all of the die on a wafer in a single touchdown.WaferPak Cartridges are custom designed uniquely for each customer wafer application to interface to the unique pad positions of a wafer des

4、ign.When used in a FOX system,WaferPak Cartridges enable the production of Known-Good Die(KGD)for use in high reliability and multi-die stacked package applications.The FOX-15 Full Wafer Contact System is designed for single-touchdown testing of up to 15 wafers at a time.Combined with BIST and Desig

5、n For Test(DFT)on state-of-the-art wafers,the FOX-15 system can be used in a wide range of test and reliability screening(burn-in)applications for devices such as memories,microcontrollers,sensors and VCSELs(laser diodes).It is especially effective for high-reliability applications,such as in the au

6、tomotive market.The FOXTM-1 Full Wafer Parallel Test System is used for wafer sort testing.By testing all devices on a wafer at one time,production test costs can be decreased significantly due to the high throughput of the system,enabling the user to significantly reduce the capital investment requ