Aehr Test Systems (AEHR) 2019年年度报告「NASDAQ」.pdf

1、2019 Annual ReportAehr Test Systems FOX-P Wafer Level Test&Burn-in Systems&WaferPak Full Wafer ContactorThe ABTSTM Advanced Burn-In and Test System is Aehr-In systems for packaged parts.It is being used for many applications in the mobility and automotive markets.It can be configured with up to 320

2、I/O channels and up to 72 Burn-in boards for testing and burning-in advanced logic devices.It offers an individual device temperature control option for higher-power applications such as applications processors.The FOX-P platform can be used in a wide range of test and reliability screening(burn-in)

3、applications for high reliability applications,such as automotive,mobile devices,networking,telecommunications,sensors,photonics and laser devices.The FOXTM-XP Burn-in and Test System,introduced in July 2016,is designed for single-touchdown testing of up to 18 wafers at a time and for testing singul

4、ated die or small modules.The FOX-NP was introduced in January 2019 and is a low-cost entry-level system to provide a configuration and price point for companies to do initial production qualification and new product introduction,enabling an easier transition to the FOX-XP system for high volume pro

5、duction test.The FOX-CP was introduced in February 2019 and is a new low-cost single-wafer compact test and reliability verification solution for logic,memory and photonic devices where test times ranging from minutes to a few hours or where multiple touchdowns are required to test the entire wafer.

6、It complements the capabilities of the FOX-XP and FOX-NP systems,which are optimal when the test time is measured in hours or days and the full wafer can be tested in a single touchdown.PRODUCTSFINANCIAL HIGHLIGHTSThe FOX-1P Full Wafer Parallel Test System,introduced in our fiscal year 2015,is desig