Known Good Die (KGD) for Chiplet Based Heterogenous Integration.pdf

1、Known Good Die(KGD)For ChipletsBased Heterogeneous Integration Yogan SenthilkumarChipletsKnown Good Die(KGD)For Chiplets Based Heterogeneous Integration Yogan Senthilkumar,Vice President Engineering,Tessolve SemiconductorAgendaIs KGD a new thing?What is the significance of KGD from Chiplet perspecti

2、ve.KGD MonitoringTraceability of KGDActual Use Case Test Leading to System Level Test in volume productionTest Flow for ChipletsBased IC.SummaryIs KGD a new thing?Dies are tested before being packaged.KGD has been there for may decades.Assembly defects and functionality at speed are tested at packag

3、e level.Third party Die could be integrated .such as HBM/SERDESIn Monolithic integration the functional requirement of the packaged parts do not change drastically from the Die level.KGD for Heterogenous IC Package Individual Die not necessarily define the full functionality of the Packaged IC.could

4、 be only partial.DPPM control is much with in the product company control.Assembly defects after package of a particular KGD many not be 100%directly detectable Additional test.Individual Die DPPM come into picture.The over all package level DPPM becomes additive of individual KGD DPPMWhat is the si

5、gnificance of KGD from Chipletsperspective.Die to die interconnect within the package only going to be in millimeters.Test times of the individual Die on ATE would be in seconds.Decision of pass or fail as KGD to be taken by then.Loop back test might very much applicable for High-Speed Interface Rea

6、lity of SI Simulation on Substrate interconnect vs actual manufactured substrate cannot be assumed to matchTight manufacturing tolerance of Line width,space etc.is critical.Net list Open/Short test of substrate+Critical hi speed substrate trace testing on sampling would help to improve packed IC yie