Building an Open Chiplet Economy.pdf

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Building an Open Chiplet Economy.pdf

1、Building an Open Chiplet EconomyChipletBuilding an Open Chiplet EconomyCliff Grossner,Ph.D.VP Market Intelligence&Innovation,OCPBapi Vinnakota,Ph.D.,Open Compute Project Lead,Lawrence Berkley LabThe Rise of Diverse Domain-Specific ArchitecturesEarly Compute EraStandard ComputationHPCGeneral Purpose

2、CPUGraphicsModern ComputationBlock ChainCognitive SecurityNLPRobotic PAsAutonomous VehiclesMachine LearningNeural NetworksDeep LearningPattern RecognitionRT TranslationAI and Machine-learning and data-heavy workloads have exploded in past 5 years and will diversify as new applications are discovered

3、 constantly From D Jani,Meta,Sep 19Chiplets Will be Everywhere Chips Are2020PowerI/OOther8.3%10s of W10s of GbpsLong life32.9%10 WGbpsRapid churn10.4%10 WGbpsCost sensitive37.7%100s of W100s of GbpsRapid churn10.7%10s of W10s of GbpsHarsh environmentDiversity in power,performance,cost,business requi

4、rementsAccenture:Harnessing the Power of the Semiconductor Value ChainFor a Chiplet EconomyTo meet huge diversity in requirements we needA core set of application specific standardsA low barrier to entry for innovationFreely customizable for applicationsBuild and let the market use as it sees fitChi

5、plet IP/SOC ArchitecturesInterconnect TechnologyPackaging TechnologyNeed New Integration Across The Value ChainEstablishing a New Open Chiplet EconomyChipletVendorsASIC(SiP)BuildersEnd UsersOpen MarketplaceIP ProvidersEDAManufacturePlatformStandardizations,Tools,Prototypes,Business WorkflowsToolsSup

6、port EcosystemPlatform Elements for Rapid GrowthBusiness WorkflowSiPIntegrationSiP DesignChiplet InterconnectStandardsDigital Chiplet Physical DescriptionsModularityDigital Chiplet FunctionalDescriptionsPHY layerLink layerTrans.layerTools and ReferenceSiP cost modelsKnown-Good Die contractsPackage A

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