Meeting AI Power Density at Scale_ Superconducting Distribution for Multi-MW Data Halls.pdf

1、Meeting AI Power Density at Scale:Superconducting Distribution for Multi-MW Data HallsAuthors:Shrikanth Venkateshappa Rittal GmbH&Co.KG,Herborn,Germany|venkateshappa.srittal.de Peter Abrell Vision Electric Super Conductors GmbH|abrellvesc-superbar.de Motivation and Scaling LimitsModern AI-scale comp

2、ute racks are now exceeding 1MW,stressing copper-based power delivery systems.Even with the shift to 800V DC,1MW per rack still demands 1,250A,requiring bulky copper busways,parallel feeds,and incurring significant resistive losses and heat.This is approaching coppers physical and thermal limits at

3、facility scale.AbstractWe propose a novel superconducting power distribution architecture designed to meet the extreme rack-scale demands of AI infrastructure.Using high-temperature superconducting(HTS)busbars,the system delivers multi-megawatt power at 800V DC with near-zero lossesachieving over 10

4、 the current density of copper in 1/5th the space.It eliminates medium-voltage layers,enabling direct,lossless power from utility AC to AI racks exceeding 1MW.Fully compatible with OCPs 800V standards,cryogenic tap-off modules provide seamless rack integration.Backed by proven HTS deployments in gri

5、d and industrial systems,this architecture transforms power delivery from a constraint into a scalable,open foundation for the AI era.Possible solution:HTS-Based 800 V Architecture OverviewHigh-temperature superconductors(HTS),such as REBCO tapes,conduct DC with near-zero resistance below 80K and su

6、pport 10 current density of copper.Proven in grid and industrial settings with current levels up to 200kA,HTS enables compact,lossless transmission.The paper proposes an 800V HTS busbar architecture to overcome coppers limitations and support scalable,high-efficiency power distribution for future da